Vibration platform cutting auxiliary device for multi-wire saw

Abstract

The invention relates to a vibration platform cutting auxiliary device for a multi-wire saw. The vibration platform cutting auxiliary device comprises a bottom plate, a motor, a motor stand, a coupler, two bearing seats, a vibrating component and a sliding platform, wherein an output shaft of the motor is connected with a drive shaft of the vibrating component through the coupler; the drive shaft is connected with an eccentric sleeve through a key and drives the eccentric sleeve to rotate; the vibrating component is sleeved on the outer surface of the eccentric sleeve; a guide rail mounting plate is fixed to a base, and guide rails are symmetrically arranged at the two sides of the guide rail mounting plate; a sliding block is fixedly installed at the bottom of a workbench, so that the workbench can reciprocate along the guide rails; and a T-shaped connector is fixedly connected with the workbench. According to the device, a cut workpiece can vibrate at high frequency in the tangential direction, and therefore the purpose of improving the workpiece machining quality and the working efficiency is achieved.

Description

technical field [0001] The invention relates to the technical field of multi-wire cutting equipment, in particular to a vibration platform cutting auxiliary device for a multi-wire cutting machine. Background technique [0002] Multi-wire cutting is a new type of cutting process that brings abrasive materials into the semiconductor processing area for grinding through high-speed reciprocating motion of metal wires, and cuts hard and brittle materials such as semiconductors into hundreds of thin slices at a time. At present, CNC multi-wire cutting has gradually replaced the traditional inner circle cutting and has become the main way of cutting hard and brittle materials. Multi-wire cutting machine equipment is widely used in the field of semiconductor material processing. [0003] In the existing multi-wire cutting processing technology, the surface line mark of the workpiece is relatively obvious, the surface quality is not ideal, and it is not conducive to the post-proces...

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Problems solved by technology

[0003] In the existing multi-wire cutting processing technology, the surface line mark of the workpiece is relatively obvious, the surface quality is not ideal, and it is not conducive to the post-processing of the product; in the existing multi-wire cutting processing technology, the method of optimizing process parameters is generally used to improve processing efficiency: Such as increasing the speed of the wire, increasing the tension of the cutting wire, reducing the diameter of the cutting wire, etc., the above methods to improve the processing efficiency will increase the risk of line interruption in the processing process, resulting in an increase in processing costs and safety risks; at the same time, when the processing efficiency When it is raised to a certain critical value, optimizing the process parameters cannot further improve its processing efficiency and surface quality of the workpiece

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