Energy storage capacitor and preparation method thereof
An energy storage and capacitor technology, applied in capacitors, electric solid devices, circuits, etc., can solve the problems of difficult energy storage efficiency of capacitors, prone to cracks, and smaller breakdown of antiferroelectric layers.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
preparation example Construction
[0069] The present invention also provides the preparation method of the energy storage capacitor, referring to Figure 7 , including the following steps:
[0070] S1: After the first trench structure is opened on the substrate, an insulating layer covering the inner wall and top surface of the first trench structure is formed by using a thermal oxidation method;
[0071] S2: Forming the bottom electrode, the ferroelectric thin film, the antiferroelectric thin film and the top electrode sequentially stacked on the second trench structure by using an atomic layer deposition method.
[0072] In the step S1 of some embodiments, the step of opening the first trench structure on the substrate includes: controlling the aspect ratio of the first trench structure opened on the substrate to be 1: 1-100: 1.
[0073] In the step S2 of some embodiments, refer to Figure 8 The step of forming the bottom electrode, the ferroelectric thin film, the antiferroelectric thin film and the top ...
Embodiment 1
[0086] Embodiment 1 provides an energy storage capacitor, which is a three-dimensional energy storage capacitor based on ferroelectric antiferroelectric coupling.
[0087] In the energy storage capacitor of embodiment 1, the constituent material of the substrate is Si, and the constituent material of the insulating layer is SiO 2 , also includes the SiO 2 The bottom electrode of the insulating layer; the ferroelectric thin film arranged on the bottom electrode; the antiferroelectric thin film arranged on the ferroelectric thin film; the top layer electrode arranged on the antiferroelectric thin film.
[0088] In the step S1 of the first embodiment, the aspect ratio of the first groove structure of the substrate is 20:1, and the inner wall is smooth.
[0089] In the step S1, a layer of SiO is oxidized on the surface of the substrate by a thermal oxidation method. 2 As an insulating layer, the thermal oxidation temperature is controlled to be 950°C, and the oxidant is H 2 O a...
Embodiment 2
[0098] Embodiment 2 provides an energy storage capacitor, which is a three-dimensional energy storage capacitor based on ferroelectric antiferroelectric coupling.
[0099] In the energy storage capacitor of embodiment 2, the constituent material of the substrate is Si, and the constituent material of the insulating layer is SiO 2 , also includes the SiO 2 The bottom electrode of the insulating layer; the ferroelectric thin film arranged on the bottom electrode; the antiferroelectric thin film arranged on the ferroelectric thin film; the top layer electrode arranged on the antiferroelectric thin film.
[0100] In the step S1 of Example 2, the aspect ratio of the first groove structure of the substrate is 20:1, and the inner wall is smooth.
[0101] In the step S1, a layer of SiO is oxidized on the surface of the substrate by a thermal oxidation method. 2 As an insulating layer, the thermal oxidation temperature is controlled to be 950°C, and the oxidant is H 2 O and O 2 , O...
PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 


