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Film layer curing device

A technology for curing device and film layer, which is applied in coating, device for coating liquid on the surface, gaseous chemical plating, etc. Layer quality, the effect of simplifying the overall structure and operating costs

Active Publication Date: 2021-11-26
CHANGXIN MEMORY TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The invention provides a film layer curing device, which is used to solve the problems that the existing film layer curing device has a complex structure and poor uniformity of the film layer thickness after curing

Method used

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Embodiment Construction

[0028] The specific implementation of the film layer curing device provided by the present invention will be described in detail below in conjunction with the accompanying drawings.

[0029] This specific embodiment provides a film layer curing device, with figure 1 It is a schematic diagram of the overall structure of the film layer curing device in the specific embodiment of the present invention, with figure 2 It is a structural schematic diagram of a light source array in a specific embodiment of the present invention. like figure 1 and figure 2 As shown, the film curing device provided in this specific embodiment includes:

[0030] a supporting platform for carrying a substrate, and the surface of the substrate has a film layer;

[0031] The light source assembly is located above the support table, and the light source assembly includes a light source array that is arranged toward the support table and projects a light-emitting surface 10 that covers the entire film...

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Abstract

The invention relates to the technical field of semiconductor manufacturing, in particular to a film layer curing device. The film layer curing device is characterized in that the film layer curing device comprises a supporting table used for bearing a substrate and a light source assembly, and the surface of the substrate is provided with a film layer; and the light source assembly is located above the supporting table, the light source assembly comprises a light source array, the light source array is arranged towards the supporting table, the projection of the light source array covers the light-emitting face of the whole film layer, the light source array comprises a plurality of point-shaped light sources evenly distributed on the light-emitting face, and light emitted by the light source array can evenly irradiate the whole film layer. Therefore, the thickness distribution uniformity of the cured film layer is improved. On one hand, the overall structure of the film layer curing device is simplified, and the operation cost is reduced; and on the other hand, the uniformity of thickness distribution of the cured film layer can be greatly improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a film curing device. Background technique [0002] With the continuous improvement of the semiconductor manufacturing process, especially the minimum line width entering below 20nm, the aspect ratio of the gap fill (gap fill) is getting larger and larger (for example, the aspect ratio is greater than 20), which makes the traditional chemical vapor deposition Process (Chemical Vapor Deposition, CVD) is facing more and more challenges in void free gap filling. In order to solve this problem, FCVD (Flow-able CVD, flowable CVD) process was developed. The film formed by the FCVD process has liquid-like fluidity, and the density of the formed film is close to that of the high-density plasma chemical vapor deposition process (HDP CVD), so that it can completely fill the gap from the bottom to the top without voids. [0003] The curing device in the traditional FCV...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05D3/06
CPCB05D3/067B05D3/06H01L21/67115C23C16/52C23C16/56B05C11/1005
Inventor 吴天成
Owner CHANGXIN MEMORY TECH INC
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