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A new type of building exterior wall technology, applied in buildings, ventilation systems, air conditioning systems, etc., can solve the problems of easy inward heat, dynamic adjustment, and reduce heat transfer capacity, so as to meet indoor temperature requirements and improve thermal insulation performance. , The effect of convenient disassembly and maintenance
Active Publication Date: 2021-11-30
SCEGC EQUIP INSTALLATION GRP COMPANY
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Problems solved by technology
The specific performance is: the heat conduction ability of the existing wall is the same inward and outward, the wall that is easy to dissipate heat outward is also easy to enter heat inward, and the wall that is not easy to dissipate heat outward is not easy to inward Therefore, the thermal insulation performance of the existing wall cannot be dynamically adjusted to adapt to the ambient temperature
[0003]
In addition, in order to avoid the transfer of outdoor high temperature in summer and outdoor low temperature in winter to the room, people design the building wall as a multi-layer composite structure to reduce its heat conduction capacity, but this method cannot completely block the heat conduction of the building wall.
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Embodiment 1
[0037] see Figure 1-Figure 2 As shown, the present invention provides a novel building exterior wall system, and the system mainly includes:
[0038] The building exterior wall 1, the two sides of the building exterior wall 1 are the building interior space and the building exterior space respectively;
[0039] The semiconductor refrigeration exterior wall panel 2 is arranged in the building exterior space of the building exterior wall 1, and defines a cavity with the building exterior wall 1;
[0040] A power supply device 3 that can switch the polarity of the power supply current, and the power supply device 3 supplies power to the semiconductor refrigeration exterior wall panel 2;
[0041] A heat exchange component connected between the cavity and the interior space of the building, and the heat exchange component heats or cools the interior space of the building according to the temperature in the cavity;
[0042] The temperature detector 4 is used to detect the tempera...
Embodiment 2
[0056] see Figure 1-Figure 5 As shown, the present invention provides a new type of building exterior wall system, and the system mainly includes: the same building exterior wall 1 as the first embodiment above, semiconductor refrigeration exterior wall panels 2, power supply devices 3, heat exchange components and The temperature detector 4; specifically, in this embodiment, the installation structure of the heat exchange component and the semiconductor refrigeration outer wall panel 2 is provided.
[0057] On the outer surface of the building exterior wall 1, a connecting bottom plate 11 is fixed by embedded bolts, and a first fixing piece 12 and a second fixing piece 13 are welded on the connecting bottom plate 11, and the first fixing piece 12 is used to fix the first loop The pipe 5 and the second fixing piece 13 are used to fix the semiconductor refrigeration outer wall panel 2 .
[0058] Specifically, regarding the above-mentioned first fixing member 12, in combinatio...
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Abstract
The invention belongs to the technical field of building external walls, and discloses a novel building external wall system. The novel building external wall system comprises a building external wall, a semiconductor refrigeration external wall panel, a power supply device, a heat exchange assembly and a temperature detector, wherein the two sides of the building external wall are provided with a building indoor side space and a building outdoor side space correspondingly, the semiconductor refrigeration external wall panel is arranged in the building outdoor side space of the building external wall, a cavity is defined between the semiconductor refrigeration external wall panel and the building external wall, the power supply device can switch the power supply electrical polarity and supplies power to the semiconductor refrigeration external wall panel, the heat exchange assembly is connected between the cavity and the building indoor side space and adjusts the temperature of the building indoor side space according to the temperature of the inner surface of the semiconductor refrigeration external wall panel, and the temperature detector is used for detecting the temperature of the building outdoor side space, the inner / outer surface temperature of the semiconductor refrigeration external wall panel and the temperature of the building indoor side space. In conclusion, the novel building external wall system has the advantages that the semiconductor refrigeration external wall panel and a control system are arranged on the building external wall , and due to the thermal-electric effect, indoor and outdoor temperature transfer of a building is effectively avoided.
Description
technical field [0001] The invention belongs to the technical field of building exterior walls, and in particular relates to a novel building exterior wall system. Background technique [0002] At present, the heat conduction capacity of the walls used in the construction field is bidirectional. The specific performance is: the heat conduction ability of the existing wall is the same inward and outward, the wall that is easy to dissipate heat outward is also easy to enter heat inward, and the wall that is not easy to dissipate heat outward is not easy to inward Therefore, the thermal insulation performance of the existing wall cannot be dynamically adjusted to adapt to the ambient temperature. [0003] In addition, in order to avoid the transfer of outdoor high temperature in summer and outdoor low temperature in winter to the room, people design the building wall as a multi-layer composite structure to reduce its heat conduction capacity, but this method cannot completely ...
Claims
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Application Information
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