Wafer processing method

Abstract

The invention provides a wafer processing method. Even if a protective tape is peeled off from the front surface of a wafer, a part of an adhesive layer is not attached to the front surface of a device, and the quality of the device is not reduced. The wafer processing method includes: a thermocompression bonding sheet arrangement step of arranging a thermocompression bonding sheet (20) on a front surface (10a) of a wafer; a cutting device preparation step of preparing a cutting device having at least a chuck table (5a) holding the wafer, a cutting unit (8) having a rotatable cutting tool for cutting the wafer while supplying cutting water, and a feeding unit for relatively processing and feeding the chuck table and the cutting unit, a cutting step of holding a back surface (10b) side of the wafer on a chuck table, cutting a division predetermined line (14) of the wafer while providing cutting water, and dividing the wafer into device chips (12 '), and a peeling step of peeling the thermocompression bonding sheet from a front surface of the device chip.

Description

technical field [0001] The present invention relates to a method of processing a wafer, which divides a wafer with a plurality of devices formed on the front side by dividing lines into individual device chips. Background technique [0002] A wafer divided by dividing lines and formed with multiple devices such as IC, LSI, CMOS, and CCD on the front surface is divided into individual device chips by a dicing device and used in electronic equipment such as mobile phones and personal computers. [0003] The dicing device includes at least: a chuck table that holds the wafer; a cutting unit that has a rotatable cutting blade that performs cutting while supplying cutting water to the wafer held on the chuck table. cutting; and a feeding unit that processes and feeds the chuck table and the cutting unit facing each other, and the cutting device can divide the wafer into individual device chips with high precision. [0004] In addition, in order to avoid the problem of adhering c...

AI Technical Summary

Problems solved by technology

However, an adhesive layer is formed on the adhesive surface of a commonly used protective tape, such as Figure 7 As shown, in the case where the dividing grooves 110 for dividing the wafer W into individual device chips D' are formed by a dicing device not shown, although it is possible to prevent chips from adhering to the device chips D' of the wafer W, when the When the protective tape 200 is peeled from the front surface Wa of the wafer W, a part of the paste constituting the adhesive layer of the protective tape 200 may adhere and remain on the front surface Wa of the device chip D′.

To describe it more specifically, the devices formed on the wafer W are several cm square (for example, about 3 cm square) in size (shown enlarged on the right side) and formed with a plurality of diameters (or one side) at intervals of 10 μm to 20 μm. In the case of an electron beam drawing device with pores H (shown enlarged on the lower side) of about 10 μm to 20 μm, when the protective tape 200 is peeled off from the wafer W, the paste 210 constituting the adhesive layer of the protective tape 200 adheres to the surface. There is a problem that the edge of the fine hole H remains like a beard and the quality deteriorates

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