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Laser processing method

A laser processing method and laser processing technology, applied in metal processing, laser welding equipment, metal processing equipment and other directions, can solve problems such as device quality degradation, and achieve the effect of eliminating quality degradation and preventing damage

Pending Publication Date: 2022-05-03
DISCO CORP
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Problems solved by technology

[0008] However, when the wafer is processed by forming a water layer on the upper surface of the wafer as described above and irradiating the wafer with laser light having an absorbing wavelength, the cavitation scatters a part of the laser light, so that the following problems exist: Problem: A part of the laser beam is irradiated to a part other than the desired processing position (such as the planned dividing line) to degrade the quality of the device

Method used

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Embodiment Construction

[0025] Hereinafter, the laser processing method according to the embodiment of the present invention will be described in detail with reference to the drawings.

[0026] exist figure 1 A perspective view of a laser processing apparatus 2 suitable for carrying out the laser processing method of this embodiment is shown in . The laser processing device 2 has: a liquid supply mechanism 4, which is arranged on the base 21, and supplies liquid to a wafer as a plate-shaped workpiece; The laser light of the wavelength; the holding unit 22, which holds the workpiece; the moving mechanism 23, which moves the laser light irradiation unit 8 and the holding unit 22 relatively; and the frame body 26, which is formed by the The moving mechanism 23 is composed of a vertical wall portion 261 erected in the Z direction indicated by a lateral direction arrow Z and a horizontal wall portion 262 extending horizontally from the upper end portion of the vertical wall portion 261 .

[0027] An opt...

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Abstract

The invention provides a laser processing method which does not damage devices formed on the front surface of a wafer and does not reduce the quality of each divided device even if fine bubbles are generated in water and the irradiated laser light is scattered. The laser processing method includes: a scattered light shielding film laminating step of laminating a scattered light shielding film for shielding scattered light of a laser beam on the upper surface side of a wafer; a holding step of holding the lower surface side of the wafer by using the chuck table; a laser processing step of forming a water layer on the upper surface side of the wafer, and irradiating a laser beam to a region to be processed of the wafer while moving the chuck table and the laser beam irradiation unit relative to each other; and a scattered light shielding film removing step of removing the scattered light shielding film from the wafer after the laser processing step.

Description

technical field [0001] The present invention relates to a laser processing method using a laser processing device. Background technique [0002] A wafer that is divided by a plurality of intersecting dividing lines and has multiple devices such as ICs and LSIs formed on the front side is divided into individual device chips by a laser processing device, and the divided device chips are used in mobile phones, personal computers, and lighting equipment and other electronic equipment. [0003] Conventionally, it is known that, before processing is performed by irradiating a laser beam having an absorbing wavelength to a wafer held by a holding unit, a liquid resin is coated on the front surface of the wafer to prevent the molten material from being generated when the laser beam is irradiated. (Debris) adheres to the device (for example, refer to Patent Document 1). [0004] In addition, the present applicant has proposed a laser processing apparatus of the following type. The...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/38H01L21/78
CPCB23K26/38H01L21/78B23K26/36B23K26/142H01L21/3043C23C14/5873C23C14/06C23C14/14C23C14/024B23K2101/40H01L21/268H01L21/56
Inventor 波多野雄二能丸圭司
Owner DISCO CORP
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