Grinding device

Abstract

The invention provides a grinding device (1) equipped with a control unit (100) and a camera (50) for capturing images of grinding tools (33a, 43a), and the control unit is provided with: a first image storage unit (112) for storing reference images (Gb1, Gb2) of the grinding tools; a second image storage unit (114) that stores images (G1, G2) of the grinding tool captured by the camera; a state detection unit (120) that compares the reference image stored in the first image storage unit and the image stored in the second image storage unit, and detects defect states (G1c, G2c) and clogging states (G1d, G2d) of the grinding tool in the images stored in the second image storage unit; a defect determination unit (132) that determines whether or not the detected defect state is within allowable values (Q1c, Q2c); and a clogging determination unit (134) that determines whether or not the detected clogging state is within the allowable values (Q1d, Q2d).

Description

technical field [0001] The present invention relates to a grinding device having a grinding unit having a rotatable grinding wheel provided in a ring shape to grind a workpiece held by a chuck table grinding abrasives. Background technique [0002] The wafer divided by the planned division line and formed with multiple devices such as IC and LSI on the front surface is ground by a grinding device to form a predetermined thickness, and then divided into individual device chips by a dicing device and a laser processing device , and are used in electronic equipment such as mobile phones and personal computers. [0003] The grinding device is configured to include: a chuck table having a holding surface for holding a wafer as a workpiece; A grinding wheel of a grinding tool that grinds a workpiece held by a table, and this grinding device can process the wafer to a desired thickness (for example, refer to Patent Document 1). [0004] Patent Document 1: Japanese Patent Laid-Op...

AI Technical Summary

Problems solved by technology

[0005] When the wafer is ground by the grinding unit, sometimes a defect occurs in the grinding wheel provided on the grinding wheel constituting the grinding unit, or the grinding chips etc. generated due to grinding the wafer adhere to the grinding wheel. Grinding the surface of the abrasive tool and causing clogging

When the grinding process is carried out by the grinding wheel with the deterioration of the chipped state, there is a problem that the wafer cannot be ground well and breakage occurs. Surface burning on the grinding surface reduces the quality of the wafer

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