Wired communication method, device and equipment and readable storage medium
A technology for wired communication and communication parameters, which is applied in the field of communication and can solve the problems of different connection methods and number of connections, and difficulty in coverage.
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[0052]In order to make those skilled in the art better understand the solution of the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.
[0053] For ease of understanding, the relevant terms involved in this article are briefly explained below:
[0054] chip-to-chip: Chips and chips are connected to each other on the same PCB board through PCB traces;
[0055] backplane: refers to two chips on two PCB boards respectively, connected through a third PCB backplane connector;
[0056] chip to module: refers to two chips on two PCB boa...
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