Wired communication method, device and equipment and readable storage medium

A technology for wired communication and communication parameters, which is applied in the field of communication and can solve the problems of different connection methods and number of connections, and difficulty in coverage.

Active Publication Date: 2021-11-30
SUZHOU LANGCHAO INTELLIGENT TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004]The physical location and number of nodes of the high-speed transmission chip in the multi-node computing system are not the same, and the channel characteristics of each node are also different, some are It is connected through the backplane method, some are connected through the chip-to-chip method, and some are connected through the optical fiber network. It is difficult to completely cover different connection methods and connection numbers when using chip fixed parameters.

Method used

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  • Wired communication method, device and equipment and readable storage medium
  • Wired communication method, device and equipment and readable storage medium
  • Wired communication method, device and equipment and readable storage medium

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Embodiment Construction

[0052]In order to make those skilled in the art better understand the solution of the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0053] For ease of understanding, the relevant terms involved in this article are briefly explained below:

[0054] chip-to-chip: Chips and chips are connected to each other on the same PCB board through PCB traces;

[0055] backplane: refers to two chips on two PCB boards respectively, connected through a third PCB backplane connector;

[0056] chip to module: refers to two chips on two PCB boa...

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Abstract

The invention discloses a wired communication method, device and equipment and a readable storage medium; the method comprises the steps: obtaining connection information of a link corresponding to a transceiver newly inserted into a system, and configuring a corresponding preset communication parameter for the link according to the connection information; after the transmission power consumption of the optical module and the optical fiber patch cord corresponding to the link is configured, monitoring the temperature and power consumption of the link; under the condition that the communication parameters are continuously adjusted, carrying out pseudo-random code detection on the link to obtain bit error rates under different communication parameters; selecting a target communication parameter from the different communication parameters by combining the bit error rates under the different communication parameters and the correspondingly monitored power consumption and temperature; and configuring a target communication parameter for the link, and using the transceiver to communicate based on the target communication parameter. In the application, when the link is established, the signal is detected and the communication parameters of the link are adjusted and optimized, so that different communication parameters can be adapted at different environment temperatures to increase the stability of channel data transmission and reduce the power consumption of the system.

Description

technical field [0001] The present application relates to the field of communication technologies, and in particular, to a wired communication method, apparatus, device, and readable storage medium. Background technique [0002] On the links of high-speed communication chips of multi-node servers, high-speed transmission interfaces are often connected to each other for communication data transmission. Before the two ends can communicate normally, the protocol synchronization between the two ends will be established first. Each channel will have different channel characteristics. For example, the common network card main chip will pass through a PCB (printed Circuit Board, printed circuit board) board and a pluggable DAC (direct attach cable, directly connected to the cable or directly connected to copper). cable) or optical module is connected to the PCB at the other end through copper cable or optical fiber transmission line, or communicates with each other through one or ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04B10/079H04B10/40
CPCH04B10/07953H04B10/07955H04B10/0799H04B10/40
Inventor 林于凯
Owner SUZHOU LANGCHAO INTELLIGENT TECH CO LTD
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