Flexible printed circuit (FPC) circulation book

Abstract

The invention relates to the technical field of Flexible printed circuit (FPC) production processes and discloses an FPC circulation book for circulation transportation of an FPC between the production processes. The FPC circulation book comprises a surface layer plate, a plurality of interlayer plates, a bottom layer plate and a bottom layer shell plate which are sequentially stacked from top to bottom and bound into a volume. A plurality of bulges which are equidistantly arranged at intervals from the edges are respectively arranged near two adjacent edges of the front surface of each interlayer plate. According to the technical scheme disclosed by the invention, the FPC can be stably and safely placed between interlayer paper for circulation transportation, FPC product damages and adverse environmental influences caused by movement and sliding during taking, placing and transportation of the FPC are reduced, and the quality and the efficiency of manual or mechanical automatic operation can be improved.

Description

technical field [0001] The invention relates to the technical field of FPC production technology, in particular to an FPC circulation book. Background technique [0002] FPC (Flexible Printed Circuit) is a flexible printed circuit board, which is favored for its light weight, thin thickness, and free bending and folding. The production of FPC products includes many processes from material cutting to shipment. Taking veneer production as an example, the process includes: material cutting, dry film sticking, alignment, exposure, development, graphic plating, stripping, surface treatment, Sticking film, pressing, curing, immersion nickel gold, printing characters, cutting, electrical testing, punching, final inspection, packaging, and shipment. Double-sided boards and multi-layer boards contain more technological processes, and the production line is very long. Different processes are distributed in different production lines, even in different workshops or on different floors...

AI Technical Summary

Problems solved by technology

Double-sided boards and multi-layer boards contain more technological processes, and the production line is very long. Different processes are distributed in different production lines, even in different workshops or on different floors. FPC needs to be transferred in different technological processes. The current main transportation method is Manually place interlayer paper between FPCs and then stack them for transportation. Because FPCs are light and thin, they are prone to wrinkles and scraps during pick-and-place and transportation. Products are easy to move with each other, scratches caused by friction, and easily scrapped due to crushing.

Images