Notebook computer shell and a notebook computer

Abstract

The invention is suitable for the technical field of notebook computers, and provides a notebook computer shell and a notebook computer, the notebook computer shell comprises a shell assembly and an external heat dissipation assembly, internal heat is conducted to a heat dissipation fan through a first copper pipe and a second copper pipe, and then the heat is blown out along with gas through the heat dissipation fan; in addition, a heat conduction box tightly attached to the first copper pipe and the second copper pipe is arranged, and the heat conduction box is connected with an external spiral cooling pipe through a liquid guide pipe, so that the first copper pipe and the second copper pipe can be cooled in an accelerated mode in a liquid cooling mode, and the cooling effect is further improved. A threaded rod is mounted at the bottom of the lower shell, and a supporting ball is arranged at the lower end of the threaded rod, so that the supporting height and angle of the lower shell can be adjusted by adjusting the stretching depth of the threaded rod in the lower shell, meanwhile, the supporting ball can be adaptively and stably contacted with the placing platform, and the use is more convenient.

Description

technical field [0001] The present disclosure relates to the technical field of notebook computers, in particular to a casing of a notebook computer and the notebook computer. Background technique [0002] Notebook computer, also known as "portable computer, laptop computer, palmtop computer or laptop computer", is characterized by a small body and is more portable than a desktop computer. It is a small, portable personal computer. Common casing materials for notebook computers include: alloy casings include aluminum-magnesium alloys and titanium alloys, and plastic casings include carbon fiber, polycarbonate PC, and ABS engineering plastics. [0003] However, most of the notebook computer casings currently on the market have low heat dissipation intensity, which is not conducive to the discharge of heat generated when the computer is running at high speed, and is not conducive to the service life of the device. Most of the devices have a complicated structure and increase t...

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Problems solved by technology

[0003] However, most of the notebook computer casings currently on the market have low heat dissipation intensity, which is not conducive to the discharge of heat generated when the computer is running at high speed, and is not conducive to the service life of the device. Most of the devices have a complicated structure and increase the volume of the device, which is not conducive to The miniaturization of computers has a high failure rate and increases the cost of use. Most devices cannot strengthen and reduce heat dissipation according to needs, and cannot be treated differently according to usage conditions. Most of the device bodies do not have brackets, which is not conducive to the adjustment of the device's placement height and slope. Not conducive to heat dissipation and use

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