Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Circulating water-saving cleaning equipment for circuit board plating line

A technology for cleaning equipment and electroplating lines, applied in cleaning methods and utensils, cleaning methods using tools, cleaning methods using liquids, etc., can solve problems such as low efficiency, environmental pollution, and impact on staff operations, and achieve high efficiency. Effect

Inactive Publication Date: 2021-12-17
郑新
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Electroplating is the process of plating a thin layer of other metals or alloys on the surface of certain metals using the principle of electrolysis. It is a process of using electrolysis to attach a layer of metal film to the surface of metal or other material parts to prevent metal oxidation. Improve wear resistance, conductivity, light reflection, corrosion resistance and improve appearance. The electroplating wire for circuit boards needs to be cleaned before it can be put into use, reducing the amount of plating solution on the plated parts, and avoiding the problem of poor use effect. The current technical considerations are not comprehensive and have the following disadvantages: At present, most circuit boards are cleaned manually, and water is easy to splash during the cleaning process, which makes the working environment worse, affects the operation of the staff, is inefficient and consumes manpower; most of the water after cleaning It is directly dumped, causing a waste of water resources and easily polluting the environment

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Circulating water-saving cleaning equipment for circuit board plating line
  • Circulating water-saving cleaning equipment for circuit board plating line
  • Circulating water-saving cleaning equipment for circuit board plating line

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] see Figure 1-Figure 2 , the present invention provides a circuit board electroplating line cycle water-saving cleaning equipment, the structure of which includes a body 1, a slide cover 2, a control panel 3, a water injection pipe 4, and a support foot 5, and the front surface of the body 1 is sequentially arranged from top to bottom. There is a control panel 3 and a sliding cover 2, the body 1 and the control panel 3 are flexibly connected, the body 1 and the sliding cover 2 are slidably matched, the top surface of the body 1 is provided with a water injection pipe 4, and the body 1 and the water injection pipe 4 are connected, the bottom surface of the body 1 is provided with four support feet 5, the body 1 and the support feet 5 are fixedly connected, the body 1 also includes a water storage chamber 11, a cleaning chamber 12, and a filter chamber 13. The left side of the body 1 is provided with a cleaning chamber 12, the water storage chamber 11 is located directly ...

Embodiment 2

[0037] see Figure 1-Figure 2 , the present invention provides a circuit board electroplating line cycle water-saving cleaning equipment, the structure of which includes a body 1, a slide cover 2, a control panel 3, a water injection pipe 4, and a support foot 5, and the front surface of the body 1 is sequentially arranged from top to bottom. There is a control panel 3 and a sliding cover 2, the body 1 and the control panel 3 are flexibly connected, the body 1 and the sliding cover 2 are slidably matched, the top surface of the body 1 is provided with a water injection pipe 4, and the body 1 and the water injection pipe 4 are connected, the bottom surface of the body 1 is provided with four support feet 5, the body 1 and the support feet 5 are fixedly connected, the body 1 also includes a water storage chamber 11, a cleaning chamber 12, and a filter chamber 13. The left side of the body 1 is provided with a cleaning chamber 12, the water storage chamber 11 is located directly ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses circulating water-saving cleaning equipment for a circuit board plating line. The equipment structurally comprises a machine body, a sliding cover, a control panel, a water injection pipe and supporting legs, and the machine body further comprises a water storage chamber, a cleaning chamber and a filtering chamber. A circuit board is placed in the cleaning chamber in the machine body, and the circuit board is fixed through a fixing mechanism, so that water in the water storage chamber is used for cleaning the surface of the circuit board, manual cleaning of the circuit board is not needed, the circuit board is in a closed environment during cleaning, splashed water does not affect the working environment, the efficiency is high, and manpower is not consumed; waste water generated after cleaning is filtered through the filtering chamber and then is drained into the water storage chamber again for circulation, so that waste of water resources is avoided, and pollution to the environment is avoided.

Description

technical field [0001] The invention relates to the field of circuit board processing equipment, in particular to a circulating water-saving cleaning equipment for a circuit board electroplating line. Background technique [0002] Electroplating is the process of plating a thin layer of other metals or alloys on the surface of certain metals using the principle of electrolysis. It is a process of using electrolysis to attach a layer of metal film to the surface of metal or other material parts to prevent metal oxidation. Improve wear resistance, conductivity, light reflection, corrosion resistance and improve appearance. The electroplating wire for circuit boards needs to be cleaned before it can be put into use, reducing the amount of plating solution on the plated parts, and avoiding the problem of poor use effect. The current technical considerations are not comprehensive and have the following disadvantages: At present, most circuit boards are cleaned manually, and water...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B08B3/02B08B3/14B08B1/04B08B13/00
CPCB08B3/02B08B3/14B08B13/00B08B1/32B08B1/12
Inventor 郑新
Owner 郑新
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com