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Fingerprint sensing chip module for smart card, and packaging method thereof

A technology for sensing chips and packaging methods, which is applied to record carriers used in machines, character and pattern recognition, instruments, etc., can solve problems such as complex thickness of the manufacturing process, and achieve the effects of shortening the process time, shortening the distance, and shortening the sensing distance

Pending Publication Date: 2021-12-17
ELAN MICROELECTRONICS CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a structure and packaging method of a fingerprint sensing chip module installed in a smart card, in order to solve the problems of complex manufacturing process and thickness

Method used

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  • Fingerprint sensing chip module for smart card, and packaging method thereof
  • Fingerprint sensing chip module for smart card, and packaging method thereof
  • Fingerprint sensing chip module for smart card, and packaging method thereof

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Embodiment Construction

[0032] In conjunction with the drawings and embodiments of the present invention, the technical means adopted by the present invention to achieve the intended purpose of the invention are further elaborated below, wherein the drawings are simplified for illustrative purposes only, and by describing the relationship between elements and components of the present invention To illustrate the structure or method invention of the present invention, therefore, the elements shown in the drawings are not presented in actual number, actual shape, actual size and actual ratio, and the size or size ratio has been enlarged or simplified to provide better description , the actual number, actual shape or actual size ratio has been selectively designed and configured, and the detailed component layout may be more complicated.

[0033] Below in conjunction with accompanying drawing, structural principle and working principle of the present invention are specifically described:

[0034] see ...

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Abstract

A fingerprint sensing chip module of the invention comprises a fingerprint sensing chip arranged on a soft substrate, the back surface of the fingerprint sensing chip is arranged on the soft substrate, a sensing array on the active surface of the fingerprint sensing chip is far away from the soft substrate, the sensing array is electrically connected with the soft substrate, and a sealing colloid covers the fingerprint sensing chip. The fingerprint sensing chip is directly arranged on the soft substrate, and independent packaging is formed, so that the processing time is shortened, the cost is reduced, the distance between the sensing array of the fingerprint sensing chip and the top surface of the sealing colloid can be effectively shortened, and the sensing sensitivity of the fingerprint sensing chip module is improved.

Description

technical field [0001] The invention relates to a fingerprint sensing chip module, in particular to a packaging method for a fingerprint sensing chip module used in a smart card. Background technique [0002] Many cards are used in people's daily life. Traditional cards are only used as information recording interfaces, such as the card user's name, expiration date, etc. With the advancement of technology, cards are no longer traditional paper cards. A chip is used to provide functions such as computing, access control, and data storage, thus forming a smart card in the prior art. Compared with traditional cards, smart cards can carry more information and reduce the chance of being counterfeited, thereby increasing the usage and popularity of smart cards. However, with the popularization of the use of smart cards, the phenomenon of unscrupulous people stealing and using other people's smart cards gradually appears. Validation features are also important. In the prior art,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K9/00G06K19/077
CPCG06K19/07745
Inventor 蔡建文何明龙
Owner ELAN MICROELECTRONICS CORPORATION
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