High-and-low-temperature-resistant conductive adhesive and preparation method thereof
A high and low temperature resistant, conductive adhesive technology, which is applied in the field of conductive adhesives, can solve problems such as bonding strength, low high-temperature conductivity, damage to electronic devices, and difficult cleaning of residual adhesives, achieving good wettability, low energy consumption, and realizing Effect of Conductive Continuity
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Embodiment 1
[0042] 1.1 High and low temperature resistant conductive adhesive is composed of the following formula ratio: conductive adhesive A component and conductive adhesive B component 100:7;
[0043] The A component of the conductive adhesive is composed of the following raw materials in parts by weight:
[0044] 100 parts of methyl biphenyl vulcanized silicone rubber, 55 parts of conductive graphite powder, 35 parts of acetylene carbon black, 150 parts of 120# gasoline, 0.5 parts of butyl titanate, 0.3 parts of butyltin dilaurate;
[0045] The B component of the conductive adhesive is composed of the following raw materials in parts by weight:
[0046] 8 parts of ethyl orthosilicate, 3.7 parts of 120# gasoline.
[0047] 1.2 The preparation method of high and low temperature resistant conductive adhesive includes the following steps:
[0048] 1) Preparation steps of component A of conductive adhesive:
[0049] a) Weighing and mixing: Weigh 100kg methyl biphenyl vulcanized silicon...
Embodiment 2
[0057] 2.1 The high and low temperature resistant conductive adhesive is composed of the following formula ratio: conductive adhesive A component and conductive adhesive B component 100:7;
[0058] The A component of the conductive adhesive is composed of the following raw materials in parts by weight:
[0059] 90 parts of methyl biphenyl vulcanized silicone rubber, 50 parts of conductive graphite powder, 28 parts of acetylene carbon black, 130 parts of 120# gasoline, 0.3 parts of butyl titanate, 0.2 parts of butyltin dilaurate;
[0060] The B component of the conductive adhesive is composed of the following raw materials in parts by weight:
[0061] 6 parts of ethyl orthosilicate, 2.5 parts of 120# gasoline.
[0062] 2.2 The preparation method of high and low temperature resistant conductive adhesive includes the following steps:
[0063] 1) Preparation steps of component A of conductive adhesive:
[0064] a) Weighing and mixing: Weigh 90kg methyl biphenyl vulcanized silic...
Embodiment 3
[0072] 3.1 The high and low temperature resistant conductive adhesive is composed of the following formula ratio: conductive adhesive A component and conductive adhesive B component 100:7;
[0073] The A component of the conductive adhesive is composed of the following raw materials in parts by weight:
[0074] 80 parts of methyl biphenyl vulcanized silicone rubber, 45 parts of conductive graphite powder, 23 parts of acetylene carbon black, 100 parts of 120# gasoline, 0.2 part of butyl titanate, 0.1 part of butyltin dilaurate;
[0075] The B component of the conductive adhesive is composed of the following raw materials in parts by weight:
[0076] 4-8 parts of ethyl orthosilicate, 1.2-3.7 parts of 120# gasoline.
[0077] 3.2 The preparation method of high and low temperature resistant conductive adhesive includes the following steps:
[0078] 1) Preparation steps of component A of conductive adhesive:
[0079] a) Weighing and mixing: Weigh 80kg methyl biphenyl vulcanized s...
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