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High-and-low-temperature-resistant conductive adhesive and preparation method thereof

A high and low temperature resistant, conductive adhesive technology, which is applied in the field of conductive adhesives, can solve problems such as bonding strength, low high-temperature conductivity, damage to electronic devices, and difficult cleaning of residual adhesives, achieving good wettability, low energy consumption, and realizing Effect of Conductive Continuity

Pending Publication Date: 2021-12-28
贵州航天风华精密设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The main purpose of the present invention is to propose a high and low temperature resistant conductive adhesive and a preparation method thereof, which are low in cost, simple in operation, easy to control, and environmentally friendly, so as to solve the problem of low bonding strength and high temperature conductivity of the adhesive of the existing conductive adhesive. In the process of reverse operation, it is not easy to disassemble, the residual glue is not easy to clean, and it is easy to cause damage to electronic devices, etc.

Method used

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  • High-and-low-temperature-resistant conductive adhesive and preparation method thereof
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  • High-and-low-temperature-resistant conductive adhesive and preparation method thereof

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Effect test

Embodiment 1

[0042] 1.1 High and low temperature resistant conductive adhesive is composed of the following formula ratio: conductive adhesive A component and conductive adhesive B component 100:7;

[0043] The A component of the conductive adhesive is composed of the following raw materials in parts by weight:

[0044] 100 parts of methyl biphenyl vulcanized silicone rubber, 55 parts of conductive graphite powder, 35 parts of acetylene carbon black, 150 parts of 120# gasoline, 0.5 parts of butyl titanate, 0.3 parts of butyltin dilaurate;

[0045] The B component of the conductive adhesive is composed of the following raw materials in parts by weight:

[0046] 8 parts of ethyl orthosilicate, 3.7 parts of 120# gasoline.

[0047] 1.2 The preparation method of high and low temperature resistant conductive adhesive includes the following steps:

[0048] 1) Preparation steps of component A of conductive adhesive:

[0049] a) Weighing and mixing: Weigh 100kg methyl biphenyl vulcanized silicon...

Embodiment 2

[0057] 2.1 The high and low temperature resistant conductive adhesive is composed of the following formula ratio: conductive adhesive A component and conductive adhesive B component 100:7;

[0058] The A component of the conductive adhesive is composed of the following raw materials in parts by weight:

[0059] 90 parts of methyl biphenyl vulcanized silicone rubber, 50 parts of conductive graphite powder, 28 parts of acetylene carbon black, 130 parts of 120# gasoline, 0.3 parts of butyl titanate, 0.2 parts of butyltin dilaurate;

[0060] The B component of the conductive adhesive is composed of the following raw materials in parts by weight:

[0061] 6 parts of ethyl orthosilicate, 2.5 parts of 120# gasoline.

[0062] 2.2 The preparation method of high and low temperature resistant conductive adhesive includes the following steps:

[0063] 1) Preparation steps of component A of conductive adhesive:

[0064] a) Weighing and mixing: Weigh 90kg methyl biphenyl vulcanized silic...

Embodiment 3

[0072] 3.1 The high and low temperature resistant conductive adhesive is composed of the following formula ratio: conductive adhesive A component and conductive adhesive B component 100:7;

[0073] The A component of the conductive adhesive is composed of the following raw materials in parts by weight:

[0074] 80 parts of methyl biphenyl vulcanized silicone rubber, 45 parts of conductive graphite powder, 23 parts of acetylene carbon black, 100 parts of 120# gasoline, 0.2 part of butyl titanate, 0.1 part of butyltin dilaurate;

[0075] The B component of the conductive adhesive is composed of the following raw materials in parts by weight:

[0076] 4-8 parts of ethyl orthosilicate, 1.2-3.7 parts of 120# gasoline.

[0077] 3.2 The preparation method of high and low temperature resistant conductive adhesive includes the following steps:

[0078] 1) Preparation steps of component A of conductive adhesive:

[0079] a) Weighing and mixing: Weigh 80kg methyl biphenyl vulcanized s...

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Abstract

The invention discloses a high-and-low-temperature-resistant conductive adhesive and a preparation method thereof. The conductive adhesive is prepared from a conductive adhesive component A and a conductive adhesive component B according to a ratio of 100: 7. The conductive adhesive component A comprises the following raw materials by weight: 80-100 parts of synthetic rubber, 45-55 parts of graphite powder, 25-35 parts of acetylene carbon black, 100-150 parts of No. 120 gasoline, 0.2-0.5 part of butyl titanate, and 0.1-0.3 part of butyltin dilaurate. The conductive adhesive component B is prepared from the following raw materials in parts by weight: 4 to 8 parts of ethyl orthosilicate and 1.2 to 3.7 parts of No. 120 gasoline. The conductive adhesive does not contain precious metals such as gold and silver, so production cost is greatly reduced, and a process is simple, easy to control, and friendly to the environment; and the conductive adhesive provided by the invention has good resistance to a high temperature of 300 DEG C and good resistance to a low temperature of -45 DEG C, also has electrical conductivity, can meet requirements on application to an aerospace craft antenna, and greatly improves the isolation and phase sensitivity of the antenna.

Description

technical field [0001] The invention relates to the technical field of conductive adhesives, in particular to a high and low temperature resistant conductive adhesive and a preparation method thereof. [0002] technical background [0003] Conductive adhesive is an adhesive with a certain conductivity after curing or drying. It usually uses matrix resin and conductive fillers, namely conductive particles, as the main components. The conductive particles are combined through the bonding effect of the matrix resin to form a conductive adhesive. Pathway to realize the conductive connection of the adhered material. Since the matrix resin of the conductive adhesive is an adhesive, a suitable curing temperature can be selected for bonding. At the same time, due to the miniaturization and miniaturization of electronic components and the rapid development of high density and high integration of printed circuit boards, The conductive adhesive can be made into a paste to achieve high ...

Claims

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Application Information

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IPC IPC(8): C09J183/04C09J9/02C09J11/06
CPCC09J183/04C09J9/02C09J11/06C08K2201/014C08K2201/001C08K3/04C08K5/5415C08K5/57
Inventor 赵继华黄田燕
Owner 贵州航天风华精密设备有限公司