Method, device and equipment for obtaining machining parameters through code scanning gun and medium
A technology of processing parameters and scanning code guns, applied in electromagnetic radiation induction, instruments, induction recording carriers, etc., can solve the problems of wafer rework and scrap, avoid wafer rework, improve work efficiency, and improve the effect of accuracy.
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[0031] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.
[0032] The present invention is mainly aimed at the setting of processing parameters (such as wafer size, wafer type, operation formula, etc.) and the method, device, equipment, and medium for obtaining processing parameters through a code scanning gun in glue-coating and developing equipment. The invention can make the operator no longer manually select the operation processing parameters, and can freely match the bar code and the formula in the machine according to the customer's wishes.
[0033] The identification code in this embodiment is in the form of a barcode, and each batch of wafers to be processed corresponds to a batch number (processing procedure), and the batch number information can be obtained through the barcode. Scanning guns can obtain barcodes. Operators can use scanning guns to scan barcodes before processing to obtain pr...
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