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Method, device and equipment for obtaining machining parameters through code scanning gun and medium

A technology of processing parameters and scanning code guns, applied in electromagnetic radiation induction, instruments, induction recording carriers, etc., can solve the problems of wafer rework and scrap, avoid wafer rework, improve work efficiency, and improve the effect of accuracy.

Pending Publication Date: 2021-12-31
SHENYANG KINGSEMI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] In the FAB, the operator needs to constantly "place the box station - select the processing parameters - process - detect", especially the step of selecting the processing parameters, which includes the size of the wafer, the type of the wafer, the processing formula, etc., Wrong selection may lead to rework of the entire batch of wafers, or even scrapping

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  • Method, device and equipment for obtaining machining parameters through code scanning gun and medium
  • Method, device and equipment for obtaining machining parameters through code scanning gun and medium
  • Method, device and equipment for obtaining machining parameters through code scanning gun and medium

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Embodiment Construction

[0031] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.

[0032] The present invention is mainly aimed at the setting of processing parameters (such as wafer size, wafer type, operation formula, etc.) and the method, device, equipment, and medium for obtaining processing parameters through a code scanning gun in glue-coating and developing equipment. The invention can make the operator no longer manually select the operation processing parameters, and can freely match the bar code and the formula in the machine according to the customer's wishes.

[0033] The identification code in this embodiment is in the form of a barcode, and each batch of wafers to be processed corresponds to a batch number (processing procedure), and the batch number information can be obtained through the barcode. Scanning guns can obtain barcodes. Operators can use scanning guns to scan barcodes before processing to obtain pr...

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Abstract

The invention discloses a method, device and equipment for obtaining machining parameters through a code scanning gun, and a medium; the method comprises the steps of receiving the machining parameters inputted by an order user, and generating a machining process; randomly generating an identification code image, performing association mapping on the identification code image and a processing procedure to generate a workpiece processing file, and outputting the procedure processing file and the identification code image; enabling the code scanning gun to scan the generated identification code image; and acquiring a workpiece processing file of the processing procedure associated with the identification code image, reading the identification code image scanned by the code scanning gun, searching the processing procedure corresponding to the identification code image in the workpiece processing file, reading processing parameters and displaying the processing parameters in the industrial personal computer. According to the invention, an operator does not need to manually select operation processing parameters, so that the work of the operator is reduced, the accuracy is improved, and the conditions of wafer reworking and scrapping are avoided to a great extent. According to the invention, the bar code can be freely matched with the formula in the machine according to the willingness of a customer, the content of the bar code is not limited, and the use is flexible.

Description

technical field [0001] The invention relates to the application of a code scanning gun in the semiconductor industry, in particular to realizing the free matching of barcodes and equipment processing formulas, so as to improve the correct operation rate of operators in daily work. Background technique [0002] In the FAB, the operator needs to constantly "place the box station - select the processing parameters - process - detect", especially the step of selecting the processing parameters, which includes the size of the wafer, the type of the wafer, the processing formula, etc., A wrong choice may lead to rework of the entire batch of wafers, or even scrapping. Therefore, "how to reduce the operator's workload" and "how to improve the operator's correct operation rate" have always been the focus and technical problems of users. Contents of the invention [0003] In order to solve the above existing problems, the present invention proposes a method, device, equipment, and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K7/10G06K7/14
CPCG06K7/10821G06K7/1408
Inventor 康宁吴昊李硕
Owner SHENYANG KINGSEMI CO LTD