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Manufacturing method of coreless substrate

A manufacturing method and coreless substrate technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve problems such as increasing production costs, achieve higher yields, better substrate surface smoothness, and improve raw material usage rate effect

Pending Publication Date: 2021-12-31
NINGBO HUAYUAN ELECTRONICS TECH
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  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, after the film is peeled off, the sacrificial carrier loses its function and is discarded, thereby increasing the production cost, and only one-sided line embedding technology can be realized, so it is necessary to design a new manufacturing method of the coreless substrate

Method used

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  • Manufacturing method of coreless substrate
  • Manufacturing method of coreless substrate
  • Manufacturing method of coreless substrate

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Embodiment Construction

[0070] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.

[0071] see Figure 1-Figure 30 , the manufacturing method of the coreless substrate, comprising the following steps:

[0072] S1, adding the first photoresist layer 21 on the top surface of the substrate copper 1, such as figure 2 As shown, exposure and development are carried out to form the first photoresist pattern, such as image 3 Shown; Wherein, the thickness of substrate copper 1 is 0.05-1.0mm, the best is 0.08-0.12mm, adjust the thickness of the first photoresist layer 21 according to the height of the first interlayer conductor 31, higher than the interlayer conductor 5-10 microns, the thickness of the first photoresist layer 21 is 30-100 microns;

[0073] S2. Electroplate the first interlayer conductor 31 in the first photoresist pattern, such as Figure 4 shown;

[0074] S3, peeling off the first photoresist layer 21, leaving ...

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Abstract

The invention discloses a manufacturing method of a coreless substrate, which comprises the steps of I, adding a photoresist layer on substrate copper, exposing and developing to form a photoresist pattern, and electroplating an electroplating conductor; and II, stripping the photoresist, and stacking an insulating layer on the electroplating conductor. Compared with the prior art, the manufacturing method has the advantages that a carrier does not need to be sacrificed, and the base material copper is directly processed, so that the raw material utilization rate of the coreless substrate is greatly improved, and the manufacturing cost is reduced; three process structures of circuit double-sided embedding, single-sided embedding or no embedding can be realized; and meanwhile, the carrier does not need to be separated, so that the processing difficulty is simplified, and the yield of the coreless substrate is improved.

Description

technical field [0001] The invention relates to a substrate, in particular to a method for manufacturing a coreless substrate. Background technique [0002] Nowadays, the components of all electronic products are pursuing lightness, thinness, shortness and smallness, so the circuit boards of load components are also required to be thinner and thinner. The traditional process uses a cored substrate as a circuit board, but even if the thickness of the cored substrate can reach, for example, 0.06mm, in the process of manufacturing, the equipment capacity is difficult to meet the transmission of such a thin substrate, and the operation of personnel on and off the board It is also easy to bring the risk of uncontrollable board breakage and board folding, which greatly reduces the yield of the product. In particular, in recent years, research has been conducted on a coreless substrate that does not have a core substrate and mainly includes buildup layers that enable high-density ...

Claims

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Application Information

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IPC IPC(8): H01L21/48H01L23/498
CPCH01L23/49805H01L23/49838H01L23/49861H01L21/4825
Inventor 张成立徐光龙王强马梦亚
Owner NINGBO HUAYUAN ELECTRONICS TECH
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