Check patentability & draft patents in minutes with Patsnap Eureka AI!

Manufacturing method of coreless substrate

A manufacturing method and coreless substrate technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as increasing production costs, achieve the effects of increasing yield, simplifying processing difficulty, and reducing manufacturing costs

Pending Publication Date: 2021-11-30
NINGBO HUAYUAN ELECTRONICS TECH
View PDF1 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, after the film is peeled off, the sacrificial carrier loses its function and is discarded, thereby increasing the production cost, and only one-sided line embedding technology can be realized, so it is necessary to design a new manufacturing method of the coreless substrate

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Manufacturing method of coreless substrate
  • Manufacturing method of coreless substrate
  • Manufacturing method of coreless substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0095] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.

[0096] see Figure 1-Figure 43 , the manufacturing method of the coreless substrate, comprising the following steps:

[0097] S1, such as Figure 1 to Figure 4 As shown, add the first photoresist layer 21 on the top surface of the substrate copper 1, expose and develop, and form the first photoresist pattern layer; wherein, the thickness of the substrate copper 1 is 0.05-1.0mm, preferably 0.08-0.12mm, adjust the thickness of the first photoresist layer 21 according to the height of the first interlayer conductor 31, 5-10 microns higher than the interlayer conductor, the thickness of the first photoresist layer 21 is 30-100 microns ;

[0098] S2, such as Figure 4 As shown, the first interlayer conductor 31 is electroplated in the first photoresist pattern layer;

[0099] S3, such as Figure 5 As shown, the first photoresist layer 21 is s...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a manufacturing method of a coreless substrate, which comprises the steps of I, adding a photoresist layer on substrate copper, exposing and developing to form a photoresist pattern, and electroplating an electroplated conductor; and II, stripping the photoresist, and stacking an insulating layer on the electroplated conductor. Compared with the prior art, the manufacturing method has the advantages that a carrier does not need to be sacrificed, and the base material copper is directly processed, so that the raw material utilization rate of the coreless substrate is greatly improved, and the manufacturing cost is reduced; and meanwhile, the carrier does not need to be separated, so that the processing difficulty is simplified, and the yield of the coreless substrate is improved.

Description

technical field [0001] The invention relates to a substrate, in particular to a method for manufacturing a coreless substrate. Background technique [0002] Nowadays, the components of all electronic products are pursuing lightness, thinness, shortness and smallness, so the circuit boards of load components are also required to be thinner and thinner. The traditional process uses a cored substrate as a circuit board, but even if the thickness of the cored substrate can reach, for example, 0.06mm, in the process of manufacturing, the equipment capacity is difficult to meet the transmission of such a thin substrate, and the operation of personnel on and off the board It is also easy to bring the risk of uncontrollable board breakage and board folding, which greatly reduces the yield of the product. In particular, in recent years, research has been conducted on a coreless substrate that does not have a core substrate and mainly includes buildup layers that enable high-density ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/768
CPCH01L21/76816H01L21/76898
Inventor 张成立王强徐光龙
Owner NINGBO HUAYUAN ELECTRONICS TECH
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com