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Signal modulation circuit, method and related product

A signal modulation and circuit technology, applied in the field of communication, can solve problems such as the blockage of large-bandwidth millimeter-wave applications and the inability to realize millimeter-wave direct modulation.

Active Publication Date: 2021-12-31
HUAWEI TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the current DAC+RF frequency conversion scheme has more and more obvious bottlenecks in power consumption, modulation bandwidth, and millimeter-wave frequency bands, and cannot realize direct modulation of millimeter-wave, thus hindering the application of large-bandwidth millimeter-wave

Method used

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  • Signal modulation circuit, method and related product
  • Signal modulation circuit, method and related product
  • Signal modulation circuit, method and related product

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0100] Example 1, see Figure 4 , Figure 4 It is a schematic structural diagram of a 4-PSK circuit provided in an embodiment of the present application.

[0101] In some possible examples, the first modulation unit includes: a first modulation signal receiving module, configured to receive the first modulation signal.

[0102] Such as Figure 4 As shown, the first modulating unit further includes a first modulated signal receiving module, the first modulated signal receives the first modulated signal, and the first modulated signal is a digital signal (b1b0) with 2 digits.

[0103] It can be seen that in this example, the first modulation unit receives the first modulation signal through the first modulation signal receiving module, thereby obtaining the first modulation signal used for signal modulation, and then performs modulation according to the first modulation signal, thereby implementing the first modulation signal Modulation of the carrier signal.

[0104] In som...

example 2

[0130] Example 2, see Figure 5 , Figure 5 It is a schematic structural diagram of an 8-PSK circuit provided in an embodiment of the present application. in, Figure 5 The 8-PSK circuit shown is in Figure 4 On the basis of the 4-PSK circuit shown, it is improved by adding a phase shifting module.

[0131] In some possible examples, n=3, the second modulation unit further includes a first phase shifting module, and the first phase shifting module includes a first phase shifter, a second phase shifter, and a second switch; The second terminal of the first switch is connected to the input terminal of the first phase shifter or the input terminal of the second phase shifter; the first terminal of the second switch is connected to the input terminal of the first phase shifter The output end or the output end of the second phase shifter is connected, and the second end of the second switch is connected to the first bridge arm or the second bridge arm of the first electric brid...

example 3

[0143] Example 3, see Figure 6 , Figure 6 It is a schematic structural diagram of a 16-PSK circuit provided in an embodiment of the present application. in, Figure 6 The 16-PSK circuit shown is in the Figure 4 On the basis of the 4-PSK circuit shown, it is improved by adding 2 phase shifting modules; that is Figure 6 The 16-PSK circuit shown is in the Figure 5 On the basis of the 8-PSK circuit shown, it is improved by adding a phase shifting module.

[0144] In some possible examples, n=4, the second modulation unit further includes a second phase shifting module, and the second phase shifting module includes a third phase shifter, a fourth phase shifter, and a third switch; The second terminal of the second switch is connected to the input terminal of the third phase shifter or the input terminal of the fourth phase shifter; the first terminal of the third switch is connected to the input terminal of the third phase shifter The output end or the output end of the ...

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Abstract

The embodiment of the invention provides a signal modulation circuit and method and a related product. The circuit comprises: a first modulation unit used for receiving a first original carrier signal and a first modulation signal, and performing first modulation on the first original carrier signal according to the first modulation signal to obtain a first carrier signal and / or a second carrier signal; the second modulation unit that is used for performing second modulation on the first carrier signal or the second carrier signal according to the first modulation signal to obtain a first modulated signal, or performing third modulation on the first carrier signal or the second carrier signal according to the first modulation signal to obtain a second modulated signal. By adopting the embodiment of the invention, direct modulation of millimeter waves can be realized, the transmitter architecture can be greatly simplified, the power consumption of the transmitter is reduced, and chip implementation is easy.

Description

technical field [0001] The present application relates to the field of communication technology, and in particular to a signal modulation circuit, method and related products. Background technique [0002] With the rapid development of technologies such as 5G networks, VR devices, ultra-high-definition video, and smart wearable devices, people have put forward higher requirements for the rate and capacity of information transmission; although the peak rate of 5G access is 1-20Gbit / s , but still cannot meet the increasing data traffic requirements in future wireless communications. At the same time, with the continuous development of wireless communication technology, the demand for high-frequency and high-speed applications is increasing, resulting in higher power consumption of wireless communication systems, and the demand for low-cost, high-energy-efficiency wireless transceivers is also continuing increase. [0003] The wireless transceiver is an important part of the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04L27/00H04L27/20H04L27/36
CPCH04L27/0014H04L27/20H04L27/36H04L2027/0018H04L27/00
Inventor 帅松林张健蔡华王光健
Owner HUAWEI TECH CO LTD