A kind of wet etching equipment

Abstract

The invention belongs to the field of wet etching, and particularly relates to a wet etching device, which includes an etching mechanism and a dipping mechanism, wherein the dipping mechanism driven by a mechanical arm drives a number of etching substrates evenly installed thereon in the etching mechanism Synchronous and uniform etching is carried out in the etching solution; the gas blown out by the air pump is guided by the column sleeve to blow off the etching solution remaining on the substrate evenly and densely at multiple points, and under the reflection of the substrate, it passes through four suction holes on the inner wall of the liquid tank. The guiding slope at the air port guides and the suction port and the filter of the absorbent cotton in the liquid analysis box are circulated to the air pump to ensure that the etching liquid will not be lost due to the flow with the gas, which is conducive to the recycling of the etching liquid flowing with the gas , At the same time, ensure that the substrate after etching will not be unevenly etched due to the residual etching solution.

Description

technical field [0001] The invention belongs to the field of wet etching, in particular to a wet etching equipment. Background technique [0002] Wet etching is an etching method, which is a technology of immersing the etching material in the corrosive liquid for etching. It mainly carves a suede surface on a relatively flat film surface, thereby increasing the optical path and reducing light reflection. Corrosion can be diluted hydrochloric acid, etc. [0003] As the size of the etched substrate increases, the unevenness of the etched surface of the substrate processed by the wet etching process becomes more and more prominent. The main reasons are as follows: [0004] 1. Because the current etching is to spray the etching solution onto the substrate through the nozzle, the concentration of the etching solution in different areas of the substrate, the etching start time and the uniformity of the distribution of the etching solution on the substrate surface are different, r...

AI Technical Summary

Problems solved by technology

[0004] 1. Because the current etching is to spray the etching solution onto the substrate through the nozzle, the concentration of the etching solution in different areas of the substrate, the etching start time and the uniformity of the etching solution distribution on the substrate surface are different, resulting in uneven etching

[0005] 2. After the substrate is etched, the etching solution on the substrate cannot be cleaned in time and effectively, which will also lead to uneven etching on the substrate

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