Composite heat conduction PCB and use method thereof

Abstract

The invention discloses a composite heat conduction PCB, and relates to the technical field of PCBs. The technical scheme is that the composite heat conduction PCB comprises a heat exchange assembly, a heat dissipation assembly and an electric shielding assembly, the top of the heat exchange assembly is fixedly provided with the heat dissipation assembly, and the top of the heat dissipation assembly is fixedly connected with the electric shielding assembly; the heat exchange assembly comprises a heat exchange seat, a lower heat dissipation sheet and an upper heat dissipation sheet, connecting frames are evenly installed on the inner wall of the heat exchange base, and heat dissipation holes are evenly formed in the outer wall of the periphery of the heat exchange base; the lower heat dissipation fins are fixedly connected with the upper heat dissipation fins in a matched manner, the heat dissipation assembly comprises a strengthening net, heat dissipation silicone grease and a circuit board substrate, and the circuit board substrate comprises a first circuit board, a second circuit board and a third circuit board. Through the cooperative use of the upper cooling fins and the lower cooling fins, the heat of the circuit board above can be conveniently transferred, so that the heat dissipation efficiency is improved; and air is in contact with the rectangular fins under the action of the heat dissipation holes, so that the heat dissipation efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of PCB boards, in particular to a PCB board with composite heat conduction and a use method thereof. Background technique [0002] Before the appearance of printed circuit boards, the interconnection between electronic components relied on the direct connection of wires to form a complete circuit. In contemporary times, circuit panels only exist as effective experimental tools, and printed circuit boards have already been used in the electronics industry. In the early 20th century, in order to simplify the production of electronic machines, reduce the wiring between electronic parts, and reduce the production cost, people began to study the method of replacing wiring with printing. Thirty Over the years, engineers have continuously proposed to add metal conductors on the insulating substrate for wiring. At present, in electronic equipment, in order to reduce the volume of electronic equipment and improve the...

AI Technical Summary

Problems solved by technology

[0003] The existing technology has the following disadvantages: when the existing PCB board is used, the electronic components are usually fixedly installed on the surface of the PCB board by plugging, usually with a one-layer or multi-layer circuit board structure, which is prone to heat conduction during use. Poor performance, resulting in increased power consumption of circuit boards and reduced work efficiency

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