Cutting device for semiconductor
A cutting device, semiconductor technology, applied in the direction of cutting device, cutting machine, metal processing equipment, etc., can solve the problems of semiconductor limit, easy clamping instability, device does not have adaptability, etc., to achieve the effect of ensuring cleanliness
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0030] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.
[0031] refer to Figure 1-7 , a cutting device for semiconductors, comprising a base 1, the upper side wall of the base 1 is symmetrically slidably connected with a vertical plate 2, the upper side wall of the base 1 is symmetrically provided with a chute matching the vertical plate 2, and the A rotating shaft 3 extending to the front side is rotatably connected between the two vertical plates 2, and a bearing 4 is fixedly embedded in the front side wall of the vertical plate 2 on the rear side of the same side, and the inner ring of each bearing 4 is connected to the rotating shaft. The outer walls of 3 are fixedly connected, and the front ends of the rotating shaft...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com