Novel full-automatic packaging device and packaging method

Abstract

The invention relates to the technical field of display packaging, in particular to a novel full-automatic packaging device and a packaging method, and belongs to the new technical field of semiconductor component packaging. The device mainly comprises five parts, namely a control unit, a CCD positioning system, a red light sensing unit, a glue sealing device and a sliding folding heater, and is a brand-new automatic packaging device, wherein the control unit in the device controls the whole operation process, and sends out a commandto enable all parts to work cooperativelyafter a clamp reaches the corresponding position of a track, the CCD positioning system and the red light sending unit are perfectly matched to accurately position the position and height difference of elements, data are transmitted to the glue sealing device, the glue sealing device works under the optimal condition, and under the cooperation of a sliding folding heater, the best product is produced. According to the invention, the device is reasonable and efficient in design, and can be suitable for various packaging devices and packaging products.

Description

technical field [0001] The invention relates to the technical field of display packaging, in particular to a novel fully automatic packaging device and packaging method, and belongs to the new technical field of semiconductor component packaging. Background technique [0002] Microdisplay is a very important development direction in the semiconductor industry. The packaging link is the most prominent part of its appearance. The quality of packaging directly affects the market competitiveness of microdisplays. However, the packaging equipment for microdisplays currently on the market Manufacturing is still very lacking, mainly the following shortcomings: [0003] First, the cofferdam and filling in the packaging process must be completed by two equipments, which not only increases the equipment cost, but also reduces the production efficiency. [0004] Second, the problem of height difference is not considered, lack of height difference measuring device, there is a height di...

AI Technical Summary

Problems solved by technology

[0003] First, the cofferdam and filling in the packaging process must be completed by two equipments, which not only increases the equipment cost, but also reduces the production efficiency

[0004] Second, the problem of height difference is not considered, lack of height difference measuring device, there is a height difference between the chip of the component and the PCB board, special attention should be paid to the height difference of the cofferdam and filling, too high filling effect is not good, too low touches the welding wire , there is no height difference test system, the staff can only manually adjust the height difference before each work and after changing the rubber, which not only wastes working time, but also does not achieve the best results in accuracy

[0005] Third, in order to ensure that the surface of the package is even and smooth, it needs to flow on the heater for a while after the package is completed, so that the entire surface can flow evenly. However, the existing equipment lacks this function and needs to use another heating device, which not only affects the flow The speed affects the texture and increases the cost of the equipment

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