Glue solution treatment device for upper scraping type copper-clad plate

Abstract

The invention discloses a glue solution treatment device for an upper scraping type copper-clad plate. The glue solution treatment device comprises a base, a positioning box body, a rotating plate, an annular filter screen and a telescopic magnetic attraction mechanism, when magnetic suction operation does not need to be carried out, a rotary clamping rod is rotated to drive a magnetic suction column to move upwards to enter a limiting cylinder, so that the magnetic suction column is separated from the inner side of an annular filter screen, and when magnetic suction operation needs to be carried out, the rotary clamping rod is rotated to drive the magnetic suction column to move downwards; the magnetic suction columns move out of the limiting cylinder downwards and reach the inner side of the annular filter screen, then the rotary plate rotates in the middle of the upper end of the positioning box body, and then the multiple telescopic magnetic suction mechanisms are driven to rotate at a low speed, so that the multiple magnetic suction columns rotate at a low speed on the inner side of the annular filter screen to magnetically suck magnetic impurities in the glue solution. In this way, the operation time of magnetic attraction can be reasonably selected, and the magnetic attraction device is very convenient to use.

Description

technical field [0001] The invention relates to an upper scraping type glue solution processing device for copper clad laminates. Background technique [0002] The manufacturing process of copper clad laminates includes glue mixing, gluing, lamination, and hot pressing; the glue mixing process is the first process, and it is also an extremely important process in the manufacturing process of copper clad laminates, because the quality of the glue will affect the subsequent coating. Copper plate quality plays a key role; due to the fierce market competition in the copper clad laminate industry, many CCL manufacturers will add some inorganic fillers to the glue formulation in order to reduce costs, and at the same time can improve some aspects of the performance of the plate. Many inorganic fillers It can be filtered through a filter, but it is difficult to handle when the filler contains a large number of small magnetic impurities, especially the content of magnetic impurities...

AI Technical Summary

Problems solved by technology

[0002] The manufacturing process of copper clad laminates includes glue mixing, gluing, lamination, and hot pressing; the glue mixing process is the first process, and it is also an extremely important process in the manufacturing process of copper clad laminates, because the quality of the glue will affect the subsequent coating. Copper plate quality plays a key role; due to the fierce market competition in the copper clad laminate industry, many CCL manufacturers will add some inorganic fillers to the glue formulation in order to reduce costs, and at the same time can improve some aspects of the performance of the plate. Many inorganic fillers It can be filtered through a filter, but it is difficult to handle when the filler contains a large number of small magnetic impurities, especially the content of magnetic impurities in fillers such as talcum powder is very high, and magnetic impurities will not only affect the appearance of the board. Certain impact, and thermal shock during PCB processing may cause delamination. If the magnetic impurities contain metal substances, it will form a short circuit in the circuit, so it is necessary to remove the magnetic impurities, so it is necessary to develop a magnetic attraction and Filter multi-functional glue processing device, and can realize the function of quick and convenient cleaning

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