Thin film packaging structure for OLED packaging and organic light emitting diode device
A thin-film packaging and device technology, which is used in the manufacture of electrical solid-state devices, semiconductor devices, semiconductor/solid-state devices, etc., can solve the problems of wrapping foreign objects, water and oxygen intrusion of OLED devices, and different sizes, and achieves reduction of barrier layers or no barrier. layer, avoid ink overflow, improve the effect of packaging reliability
Pending Publication Date: 2022-01-28
EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD
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Problems solved by technology
[0003] In the prior art, the failure of OLED devices is usually caused by foreign matter that causes cracks in the first inorganic layer 2 of the thin-film packaging structure, which leads to the intrusion of water and oxygen, and the foreign matter is irregular in shape and different in size. The inorganic layer cannot wrap foreign matter very well, so the first inorganic layer of the thin film encapsulation structure is particularly important
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[0030] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0031] It should be noted that, in the case of no conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other.
[0032] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the present invention.
[0033] The present invention includes a thin film encapsulation structure for OLED encapsulation, ...
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Abstract
The invention relates to the technical field of packaging of semiconductor functional devices, in particular to a thin film packaging structure for OLED packaging and an organic light emitting diode device, the thin film packaging structure comprises a first organic layer and a first inorganic layer which sequentially cover the upper surface of a substrate, and the first inorganic layer comprises a stacking structure formed by a plurality of thin film layers. The thin film packaging structure has the beneficial effects that the thin film packaging structure for OLED packaging is provided, the thin film packaging structure can effectively cover foreign matters, and the packaging reliability is improved; the thin film packaging structure can be used for a flexible bending foldable display screen; and the first organic layer adopts SiOC to replace an ink material used in existing mass production, so that the problem of ink overflow can be avoided, and a narrow frame effect can be achieved by reducing barrier layers or without barrier layers.
Description
technical field [0001] The invention relates to the technical field of encapsulation of semiconductor functional devices, in particular to a thin film encapsulation structure for OLED encapsulation and an organic light emitting diode device. Background technique [0002] AMOLED (Active-matrix organic light emitting diode, active matrix organic light-emitting diode) has attracted much attention due to its advantages of active light emission, fast response speed, high definition, wide viewing angle, low energy consumption and flexible display. Among them, the electrodes and light-emitting layers of OLED (Organic Light-Emitting Diode, Organic Light-Emitting Diode) devices are very sensitive to water and oxygen. They are prone to chemical reactions and fail when they meet water or oxygen, which affects the service life of OLEDs. Therefore, it is necessary to effectively treat OLEDs. encapsulation. At present, the thin-film packaging structure used in flexible mass production is...
Claims
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Login to View More IPC IPC(8): H01L51/52H01L51/50
CPCH10K50/00H10K50/84H10K50/8445
Inventor 杨正杰翟保才段丹妮
Owner EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD