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Busbar assembly and method for manufacturing busbar assembly
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A technology for busbars and components, which is used in contact manufacturing, semiconductor/solid-state device manufacturing, electrical components, etc., and can solve problems such as deterioration of connection strength and deterioration of insulation performance.
Pending Publication Date: 2022-02-08
SANCALL CORP
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[0021] However, if laserprocessing is performed like this, it will be as follows Figure 21 As shown in (c), part of the gap filling portion 525 is melted by the laser, and pinholes 527 may be generated in the gap filling portion 525
[0022] The pinholes 527 lead to deterioration of the insulation performance and connection strength between the first and second bus bars 510a, 510b
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Embodiment approach 1
[0078] Hereinafter, an embodiment of the busbar assembly of the present invention will be described with reference to the drawings.
[0079] figure 1 and figure 2 In , a plan view and a bottom view of the bus bar assembly 1 according to the present embodiment are respectively shown.
[0080] in addition, image 3 (a), showing along figure 1 The sectional view of line III(a)-III(a) in.
[0081] and, image 3 (b), showing image 3 Enlarged view of part III(b) in (a).
[0082] Such as Figure 1 ~ Figure 3 As shown, the busbar assembly 1 has: a plurality of busbars 10 formed of conductive flat members arranged on the same plane with gaps 19 between their sides; and an insulating resin layer 30 adhered to fixed to the plurality of bus bars 10 .
[0083] The bus bar assembly 1 of the present embodiment has two bus bars 10 a and 10 b as the plurality of bus bars 10 .
[0084] Such as image 3 As shown in (a) and (b), the first and second busbars 10a, 10b have a first su...
Embodiment approach 2
[0168] Hereinafter, another embodiment of the busbar assembly of the present invention will be described with reference to the drawings.
[0169] Figure 12 In , a plan view of the busbar assembly 2 of this embodiment is shown.
[0170] in addition, Figure 13 (a), showing along Figure 12 The cross-sectional view of line XIII(a)-XIII(a) in .
[0171] and then, Figure 13 (b) is a longitudinal cross-sectional view of a semiconductor module 102 in which a semiconductor element 110 is mounted on the bus bar assembly 2 .
[0172] In addition, in the figure, the same reference numerals are assigned to the same components as those in the first embodiment, and description thereof will be appropriately omitted.
[0173] The busbar assembly 2 of the present embodiment has a configuration different from that of the busbar assembly 1 of the first embodiment with regard to the blocking structure of the sealing resin 130 .
[0174] That is, in the busbar assembly 1 according to Embo...
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Abstract
Busbarassembly (1), (2) according to the present invention is provided with: a plurality of busbars (10a, 10b) arranged in parallel with a gap (19) therebetween in the same plane; and an insulative resin layer (30) that includes a gap filling part (31) and a first surface-side laminate part (40), wherein the first surface-side laminate part (40) has provided thereto a plurality of first surface-side center openings (41a, 41b) that expose prescribed portions in first surfaces (11) of the plurality of busbars and form a plurality of exposure regions, and the insulative resin layer (30) is formed from an insulative resin material (240) which is transparent in a semi-cured state and is nontransparent in a completely cured state.
Description
technical field [0001] The present invention relates to a busbarassembly in which a plurality of busbars are electrically insulated and mechanically connected and a manufacturing method thereof. Background technique [0002] There has been proposed a bus bar assembly including a plurality of bus bars electrically insulated from each other and mechanically connected, and has been used in various fields. [0003] For example, there has been proposed a laminated busbar assembly in which one flat busbar and other flat busbars are stacked up and down in parallel with each other (see Patent Documents 1 and 2 below). [0004] In the stacked busbar assembly, the opposing planes of one flat busbar and the opposing planes of the other flat busbars are arranged to face each other across the entire surface with the insulating resin layer interposed therebetween. Therefore, it is difficult to sufficiently ensure insulation. The question of reliability. [0005] In particular, if the t...
Claims
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Application Information
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