Heat dissipation shell, processing method thereof and conduction heat dissipation module

Abstract

The invention relates to a heat dissipation shell and a processing method thereof and a conduction heat dissipation module. The heat dissipation shell comprises a frame and a heat transfer bottom plate, wherein the heat transfer bottom plate is detachably installed on one side of the frame; the other side of the frame is fixedly connected with an extension part, and the extension part is used for fixing the PCB; and at least one thickness-adjustable flexible heat transfer device is detachably mounted on one side, close to the frame, of the heat transfer bottom plate. The heat dissipation shell also comprises a PCB and a chip. The processing method of the heat dissipation shell comprises the steps that the frame, the heat transfer bottom plate and the cover plate are sequentially machined and formed, and the other side of the frame extends outwards to form the extension part; and the heat transfer bottom plate is detachably installed on one side of the frame, and the flexible heat transfer device is detachably installed on the side, close to the frame, of the heat transfer bottom plate, so that the heat dissipation shell is formed. The heat dissipation shell is simple in structure, and the heat dissipation shell is designed in a split mode, so that the contact precision of the flexible heat transfer device and the chip is improved, standardized machining and production of a single component are achieved, the machining efficiency is greatly improved, and disassembly and assembly are convenient.

Description

technical field [0001] The invention relates to the technical field of conduction and heat dissipation, in particular to a heat dissipation housing, a processing method thereof, and a conduction and heat dissipation module. Background technique [0002] The signal processing module is becoming more and more stringent for electromagnetic compatibility, and the closed VPX conduction cooling module or LRM conduction cooling module is gradually replacing the air-cooled CPCI plug-in. The traditional closed VPX conduction cooling module or LRM conduction cooling module shell usually adopts mechanical processing to process two parts: the shell and the cover plate. The cover plate can usually be used as a general-purpose part, but the shell is usually machined directly from a whole piece of aluminum alloy through milling. The man-hours required for shell processing are very high and the efficiency is low; Design, not universal. [0003] In addition, conduction heat dissipation mod...

AI Technical Summary

Problems solved by technology

The cover plate can usually be used as a general-purpose part, but the shell is usually machined directly from a whole piece of aluminum alloy through milling. The man-hours required for shell processing are very high and the efficiency is low; design, not universal

[0003] In addition, conduction heat dissipation modules generally have multiple chips that need heat dissipation. This design is an over-defined assembly in terms of mechanical assembly. Due to processing errors, not all chips can be completely in contact with the heat conduction boss.

This incomplete contact error is mainly caused by two errors, which are: 1. The height error between the upper surface of the chip after welding and the PCB board caused by batches during the chip welding process; 2. Conductive heat dissipation shell During the body processing, the boss and the chip cannot be attached due to processing errors

The above-mentioned defects caused the heat transfer efficiency of the chip to be low, which caused the processing chip to often crash due to unfavorable heat dissipation.

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