Heat dissipation shell, processing method thereof and conduction heat dissipation module

A heat-dissipating shell and processing method technology, applied in the direction of modification through conduction heat transfer, cooling/ventilation/heating transformation, support structure installation, etc., can solve the problems of processing error, crash, lack of versatility, etc.

Inactive Publication Date: 2022-02-11
GUILIN CHANGHAI DEV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The cover plate can usually be used as a general-purpose part, but the shell is usually machined directly from a whole piece of aluminum alloy through milling. The man-hours required for shell processing are very high and the efficiency is low; design, not universal
[0003] In addition, conduction heat dissipation modules generally have multiple chips that need heat dissipation. This design is an over-defined assembly in terms of mechanical assembly. Due to processing errors, not all chips can be completely in contact with the...

Method used

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  • Heat dissipation shell, processing method thereof and conduction heat dissipation module
  • Heat dissipation shell, processing method thereof and conduction heat dissipation module
  • Heat dissipation shell, processing method thereof and conduction heat dissipation module

Examples

Experimental program
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Effect test

Embodiment 1

[0061] On the basis of the above structure, in this embodiment, the other side of the frame 7 is fixedly connected with an extension part, and the extension part is used for fixing the PCB board 3 . The solution is simple in structure and reasonable in design, and the extension part is integrally formed with the frame 7 to increase the internal space of the frame 7 and facilitate the installation of the PCB board 3 .

Embodiment 2

[0063] On the basis of Embodiment 1, in this embodiment, the extension part is preferably a frame-shaped structure that matches the shape of the frame 7 , which facilitates the fixed installation of the PCB 3 during installation and ensures the stability of the installation of the PCB 3 .

[0064] Based on the above solution, the thickness of the extension part can be equal to the thickness of the frame 7 or smaller than the thickness of the frame 7, preferably the latter, which is convenient for installing the PCB board 3 and saves space.

Embodiment 3

[0066] On the basis of any one of Embodiment 1 to Embodiment 2, in this embodiment, the extension part is covered with a cover plate 4 . The cover plate 4 forms a closed shell with the frame 7 and the heat transfer bottom plate 6, which facilitates the subsequent installation of the PCB board 3 and the chip 2 and forms a suitable working environment.

[0067] Based on the solution of Embodiment 1, the cover plate 4 is directly fixed on the other side of the frame 7 at this time.

[0068] Based on the solution of Embodiment 2, the cover plate 4 is fixedly installed on the extension of the frame 7 at this time, so that the space enclosed between the cover plate 4, the heat transfer bottom plate 6 and the frame 7 is larger, and it is convenient to install the PCB board 3 and chip 2.

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Abstract

The invention relates to a heat dissipation shell and a processing method thereof and a conduction heat dissipation module. The heat dissipation shell comprises a frame and a heat transfer bottom plate, wherein the heat transfer bottom plate is detachably installed on one side of the frame; the other side of the frame is fixedly connected with an extension part, and the extension part is used for fixing the PCB; and at least one thickness-adjustable flexible heat transfer device is detachably mounted on one side, close to the frame, of the heat transfer bottom plate. The heat dissipation shell also comprises a PCB and a chip. The processing method of the heat dissipation shell comprises the steps that the frame, the heat transfer bottom plate and the cover plate are sequentially machined and formed, and the other side of the frame extends outwards to form the extension part; and the heat transfer bottom plate is detachably installed on one side of the frame, and the flexible heat transfer device is detachably installed on the side, close to the frame, of the heat transfer bottom plate, so that the heat dissipation shell is formed. The heat dissipation shell is simple in structure, and the heat dissipation shell is designed in a split mode, so that the contact precision of the flexible heat transfer device and the chip is improved, standardized machining and production of a single component are achieved, the machining efficiency is greatly improved, and disassembly and assembly are convenient.

Description

technical field [0001] The invention relates to the technical field of conduction and heat dissipation, in particular to a heat dissipation housing, a processing method thereof, and a conduction and heat dissipation module. Background technique [0002] The signal processing module is becoming more and more stringent for electromagnetic compatibility, and the closed VPX conduction cooling module or LRM conduction cooling module is gradually replacing the air-cooled CPCI plug-in. The traditional closed VPX conduction cooling module or LRM conduction cooling module shell usually adopts mechanical processing to process two parts: the shell and the cover plate. The cover plate can usually be used as a general-purpose part, but the shell is usually machined directly from a whole piece of aluminum alloy through milling. The man-hours required for shell processing are very high and the efficiency is low; Design, not universal. [0003] In addition, conduction heat dissipation mod...

Claims

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Application Information

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IPC IPC(8): H05K7/20H05K7/14
CPCH05K7/2039H05K7/14
Inventor 袁红伟谭升海石志勋黄以明周梦清洪能超梁业贵
Owner GUILIN CHANGHAI DEV
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