Die bonding head angle correction mechanism and die bonding equipment
A technology for angle correction and die-bonding, which is applied to conveyor objects, semiconductor/solid-state device manufacturing, electrical components, etc., can solve problems such as low correction efficiency, increased production costs, and cumbersome correction processes, and achieve material and assembly cost savings. , the effect of improving efficiency
Pending Publication Date: 2022-02-15
东莞市盟拓智能科技有限公司
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Problems solved by technology
However, the correction process of this angle correction mechanism is cumbersome, and such a configuration will lead to increased production costs and low correction efficiency
Method used
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[0039] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.
[0040] In describing the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", The orientation or positional relationship indicated by "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying No device or element must have a specific orientation, be constructed, an...
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The invention discloses a die bonding head angle correction mechanism and die bonding equipment, and relates to the field of semiconductor equipment. The die bonding head angle correction mechanism comprises an adsorption mechanism, a first driving module and a control mechanism, wherein the adsorption mechanism is provided with a rotating shaft, one end of the rotating shaft is used for adsorbing a wafer, the first driving module is connected with the adsorption mechanism, and is used for driving the rotating shaft to rotate to a preset angle so as to carry out angle correction on the wafer, the control mechanism is electrically connected with the adsorption mechanism and the first driving module, and after one end of the rotating shaft of the adsorption mechanism adsorbs the wafer, the rotating shaft of the adsorption mechanism is controlled to rotate through mutual cooperation of the control mechanism and the first driving module so as to correct the angle of the wafer. According to the invention, the die bond head angle correction mechanism can save materials and assembly cost and further improve the efficiency of die bond head angle correction.
Description
technical field [0001] The invention relates to the field of semiconductor equipment, in particular to a die-bonding head angle correction mechanism and die-bonding equipment. Background technique [0002] The crystal bonding machine is the key equipment in the LED packaging production line. The crystal bonding process is as follows: the glue dispensing device first dispenses glue on the crystal bonding station of the substrate, and then the swing arm (also called the crystal arm) lifts the chip from the chip ring Take it out and transfer it to the die-bonding station where the glue has been dispensed. When all qualified wafers on the wafer ring have been taken out, the wafer ring is removed from the wafer table, and a new wafer ring is placed on it, the angle is corrected, and then the die bonding starts. [0003] At present, the LED chip angle correction mechanism takes out the chip from the chip ring and places it horizontally on the upper surface of the ceramic vacuum p...
Claims
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IPC IPC(8): H01L21/68H01L21/677H01L21/67H01L33/48
CPCH01L21/68H01L21/67796H01L21/67121H01L33/48
Inventor 梁杰坤杨行志
Owner 东莞市盟拓智能科技有限公司