Calibration system and calibration method of temperature sensor chip

A temperature sensor and calibration system technology, applied in thermometer testing/calibration, thermometers, instruments, etc., can solve the problems of long calibration time, high cost, complicated construction, etc., and achieve the effect of short calibration time, low cost and high calibration efficiency

A temperature sensor and calibration system technology, applied in thermometer testing/calibration, thermometers, instruments, etc., can solve the problems of long calibration time, high cost, complicated construction, etc., and achieve the effect of short calibration time, low cost and high calibration efficiency

CN101750170AActive Publication Date: 2010-06-23SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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  • Calibration system and calibration method of temperature sensor chip
  • Calibration system and calibration method of temperature sensor chip
  • Calibration system and calibration method of temperature sensor chip

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Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] like figure 2 As shown, the calibration system of the temperature sensor chip of the present invention includes a test board and a temperature calibration system; the test board is provided with a temperature sensor reference chip (REF IC) and a plurality of chips to be calibrated, and each chip is uniformly addressed and discharged on the test board , so that each chip has a different device address; each chip communicates with the temperature calibration system through a unified digital interface.

[0027] The temperature calibration system is used to read the temperature data of the reference chip and the chip to be calibrated, and form calibration data to calibrate the temperature sensor chip.

[0028] The accuracy of the temperature sensor reference chip is higher than that of the chip to be calibrated. The reference chip is used to collect the ambient temperature information of the chip to be calibrated.

[0029] The number of chips to be calibrated can be adju...

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Abstract

The invention discloses a calibration system of a temperature sensor chip, which comprises a test board and a temperature calibration system, wherein the test panel is provided with a temperature sensor reference chip and a chip to be calibrated; and each chip is connected and communicates with the temperature calibration system through a unified digital interface. The temperature calibration system reads the temperature values of various calibration chips and reference chips through the unified digital interface; and various chips to be calibrated simultaneously acquire the data, thereby realizing synchronous acquisition and calibration of multichip data, greatly improving the acquisition efficiency of the data and reducing the test and calibration time of the chips and calibration cost. The invention has the advantages of simple structure, easy building, short calibration time, high calibration efficiency, low cost, high degree of automation and the like. The invention also discloses a calibration method of the temperature sensor chip.

Description

technical field [0001] The invention relates to a test method for a semiconductor integrated circuit, in particular to a calibration system for a temperature sensor chip, and also relates to a calibration method for the temperature sensor chip. Background technique [0002] The measurement accuracy of CMOS high-precision temperature sensors is affected by many factors such as manufacturing process deviation and packaging stress. In order to meet the precision design requirements of the chip, the temperature sensor chip after preliminary screening and packaging must be calibrated. [0003] The structure of the existing temperature sensor calibration system is as follows: figure 1 As shown, it includes a temperature calibration system and a temperature measuring instrument; the temperature calibration system is used to collect the measurement data of the chip to be calibrated, and the temperature measuring instrument is used to collect the working environment temperature data ...

Claims

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Application Information

Patent Timeline
23 Jun 2010
Publication
CN101750170A
IPC
G01K15/00
Inventors
赵锋