Multilayer metal capacitor structure and preparation method thereof
A capacitor structure and multi-layer metal technology, which is applied in capacitors, circuits, electrical components, etc., can solve problems such as inability to contact areas, increase production costs, and increase capacitance density, so as to save chip area, save production costs, and increase capacitance density. Effect
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[0032] A kind of preparation method of multilayer metal capacitance structure of the present invention, comprises the steps:
[0033] (1), first deposit a metal layer, and photoetch to form the first layer of capacitor lower plate;
[0034] (2), deposit the first layer capacitor dielectric layer on the lower plate of the first layer capacitor, then deposit the metal layer, and then photoetch to form the upper plate of the first layer capacitor;
[0035] (3) Deposit an oxide layer on the bottom plate of the first layer capacitor and planarize and grind to form the first metal insulating layer;
[0036] (4) Carry out through-hole photolithography to the first layer of metal insulating layer, fill conductive material in the through-hole, and lead out the upper pole plate of the first layer capacitor and the lower pole plate of the first layer capacitor;
[0037] (5) Deposit a metal layer on the top of the first layer of metal insulating layer, and photolithographically form the ...
Embodiment 1
[0044] Such as figure 1 As shown, the multilayer metal capacitor structure in Embodiment 1 includes a first electrode 1, a second electrode 2, a first layer of capacitor lower plate 3, a first layer of capacitor dielectric layer 4, a first layer of capacitor upper plate 5, a first layer of capacitor upper plate 5, a first layer of capacitor The lower pole plate 6 of the two-layer capacitor, the first contact metal 7 , the second capacitor dielectric layer 8 , the upper pole plate 9 of the second capacitor and each metal insulating layer.
[0045] The first electrode 1 and the second electrode 2 are located on the top, and the first electrode 1 and the second electrode 2 are arranged in the same layer. The lower pole plate 3 of the first layer capacitor and the lower pole plate 6 of the second layer capacitor are all located below the two electrodes, and the lower pole plate 3 of the first layer capacitor and the lower pole plate 6 of the second layer capacitor are arranged at ...
Embodiment 2
[0058] Such as figure 2 As shown, the multilayer metal capacitor structure includes a first electrode 1, a second electrode 2, a first layer capacitor lower plate 3, a first layer capacitor dielectric layer 4, a first layer capacitor upper plate 5, a second layer capacitor lower plate Plate 6, first contact metal 7, second capacitor dielectric layer 8, second capacitor upper plate 9, third capacitor lower plate 10, second contact metal 11, third capacitor dielectric layer 12, third capacitor The upper plate 13 and each layer of metal insulation layer.
[0059] The first electrode 1 and the second electrode 2 are located on the top, and the first electrode 1 and the second electrode 2 are arranged in the same layer. The lower pole plate 3 of the first layer capacitor, the lower pole plate 6 of the second layer capacitor and the lower pole plate 10 of the third layer capacitor are all located below the two electrodes, and the lower pole plate 3 of the first layer capacitor and...
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