Low-profile broadband metasurface microstrip patch antenna and preparation method thereof

A microstrip patch antenna and metasurface technology, applied in antennas, resonant antennas, electrical short antennas, etc., can solve the problems of increasing the size of the antenna, increasing the difficulty of antenna analysis, and difficult to greatly improve the working bandwidth of the antenna.

Pending Publication Date: 2022-02-15
GUANGZHOU AURORA TECHNOLOGIES CO LTD
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, methods such as increasing the number of parasitic resonators and irregular slot loading will either increase the size of the antenna, or greatly increase the difficulty of antenna analysis; and it is difficult to greatly increase the operating bandwidth of the antenna
Therefore, it is a challenge to design a microstrip patch antenna that achieves a large operating bandwidth while maintaining a low profile

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Low-profile broadband metasurface microstrip patch antenna and preparation method thereof
  • Low-profile broadband metasurface microstrip patch antenna and preparation method thereof
  • Low-profile broadband metasurface microstrip patch antenna and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0037] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0038] The purpose of the present invention is to provide a low-profile broadband metasurface microstrip patch antenna and its preparation method, which can achieve a larger working bandwidth while maintaining a low profile

[0039] In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific emb...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to a low-profile broadband metasurface microstrip patch antenna and a preparation method thereof. The patch antenna comprises a feeder line, a first dielectric substrate, a slotted patch, a second dielectric substrate and a radiation patch which are sequentially stacked, wherein the feeder line comprises a microstrip line and a tail end fan-shaped patch connected with the microstrip line, the radius and the angle of the fan-shaped patch at the tail end are used for adjusting the working bandwidth of the low-profile broadband metasurface microstrip patch antenna, a rectangular slot is formed in the slotted patch, the length, the width and the position of the rectangular slot are used for adjusting the working bandwidth of the low-profile broadband metasurface microstrip patch antenna, the feeder line and the slotted patch feed power to the radiation patch in a coupled feeding mode so as to realize radiation and reception of signals, the radiation patch comprises a plurality of isosceles right triangle patches, and the isosceles right triangle patches are used for adjusting the surface current of the radiation patch. According to the invention, a relatively large working bandwidth can be realized while a low profile is maintained.

Description

technical field [0001] The invention relates to the field of wireless communication, in particular to a low-profile broadband supersurface microstrip patch antenna and a preparation method. Background technique [0002] With the rapid development of wireless communication technology, requirements such as miniaturization and broadband are put forward for antennas used in wireless communication systems. Microstrip patch antenna has many advantages such as compact structure, low profile, light weight, easy processing, and can be integrated with microwave circuits. It can well meet the needs of wireless communication technology and is widely used in wireless sensing, communication and radar systems, etc. , so it has become a hot technology that has attracted much attention. [0003] Traditional microstrip patch antennas, such as rectangular patch antennas, have a relatively narrow operating bandwidth due to their relatively high quality factor, which is difficult to meet the ne...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01Q9/04H01Q5/10H01Q5/30H01Q5/50H01Q15/00H05K3/02H05K3/06H05K3/24H05K3/22
CPCH01Q9/0414H01Q9/045H01Q5/50H01Q5/30H01Q5/10H01Q15/0086H05K3/022H05K3/06H05K3/241H05K3/22
Inventor 刘福扩刘宇鹏赖辉信陈成彪
Owner GUANGZHOU AURORA TECHNOLOGIES CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products