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Chip tube socket heating method and device

A heating device and tube base technology, applied in the field of chip manufacturing, can solve problems affecting production progress, heating preset time, etc.

Inactive Publication Date: 2022-02-15
GUILIN OPTOSEAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to provide a chip tube holder heating method and device, which aims to solve the existing problems of heating on the working platform, the preset heating time, and affecting the production progress.

Method used

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  • Chip tube socket heating method and device
  • Chip tube socket heating method and device
  • Chip tube socket heating method and device

Examples

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Embodiment Construction

[0026] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

[0027] In describing the present invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", The orientation or positional relationship indicated by "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than Nothing indicating or implying that a referenced device or element...

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Abstract

The invention relates to the technical field of chip manufacturing, in particular to a chip tube socket heating method and device. A placing groove is slidably connected with a heating chamber; a first heat insulation layer is fixedly connected with the heating chamber; a sliding plate is slidably connected with the heating chamber; an electromagnetic plate is fixedly connected with the sliding plate; a magnetic conductive strip is fixedly connected with the electromagnetic plate; the second heat insulation layer is fixedly connected with the placing groove; a heating lamp panel is detachably connected with the second heat insulation layer; the heating block is fixedly connected with the second heat insulation layer; a sealing strip is fixedly connected with the placing groove; under the sealing environment of the heating chamber and the placing groove, the electromagnetic plate is electrified to generate eddy current and heat the top of the tube socket; the heating lamp panel emits light and heats the bottom of the tube socket, and the heating block heats the side wall of the tube socket; multiple heating structures are used for heating at the same time, so that the heating efficiency of the tube socket is improved; the problem that the production schedule is affected due to the fact that heating is conducted on an existing working platform for a preset heating time is solved.

Description

technical field [0001] The invention relates to the technical field of chip manufacturing, in particular to a chip tube seat heating method and device. Background technique [0002] The eutectic machine is a device for soldering chips on the tube base. The chip is welded on the socket by soldering. During the welding process, the tube seat needs to be heated in advance. [0003] In the existing eutectic machine equipment, the tube holders are uniformly placed in the tube holder frame, a tube holder is picked up by the suction head, moved to the working platform, and then welded with the chip after the working platform is heated. However, heating each tube base to a preset temperature or heating for a preset time will reduce work efficiency and affect production progress. Contents of the invention [0004] The object of the present invention is to provide a method and device for heating a chip base, aiming at solving the existing problems of heating on a work platform, h...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05B3/00H05B3/02H05B3/04H05B6/10H05B6/36H05B6/06H05B1/02
CPCH05B3/0047H05B3/02H05B3/04H05B6/10H05B6/36H05B6/06H05B1/0233Y02B30/00
Inventor 王波屈显波谈勇蒋华
Owner GUILIN OPTOSEAL TECH CO LTD
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