Method for accurately acquiring photoetching parameters
A lithography parameter and accurate technology, applied in the direction of microlithography exposure equipment, optics, optomechanical equipment, etc., can solve the problems of unfavorable process stability, time-consuming, non-uniform screening standards, etc., to improve production efficiency and improve Stability, the effect of avoiding errors
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[0026] Embodiments of the method for accurately obtaining photolithography parameters provided by the present invention will be described in detail below in conjunction with the accompanying drawings.
[0027] figure 1 It is a schematic diagram of the steps of an embodiment of the method for accurately obtaining lithographic parameters in the present invention. see figure 1 , the method for accurately obtaining photolithography parameters includes the following steps:
[0028] Step S10, using the same mask pattern as a mask, and performing photolithography on the target carrier under different preset photolithography parameters to obtain multiple target patterns.
[0029] The mask patterns are composed of the same type or different types of photolithography patterns. The type may refer to the density of the photolithography pattern, for example, dense pattern, semi-dense pattern and isolated pattern. The mask pattern may only consist of a single type of photolithography pa...
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