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Wafer pre-alignment method, wafer pre-alignment system and storage medium

A pre-alignment and wafer technology, applied in the field of manufacturing, can solve the problems of long pre-alignment time and complexity, and achieve the effect of small amount of calculation and short time consumption

Pending Publication Date: 2022-02-18
HANS LASER TECH IND GRP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In traditional related technologies, there are many methods for wafer pre-alignment, but most of them are relatively complicated and take a long time to pre-align

Method used

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  • Wafer pre-alignment method, wafer pre-alignment system and storage medium
  • Wafer pre-alignment method, wafer pre-alignment system and storage medium
  • Wafer pre-alignment method, wafer pre-alignment system and storage medium

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Embodiment Construction

[0045] In order to make the purpose, technical solution and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, and are not intended to limit the present application.

[0046] The wafer pre-alignment method provided by this application can be applied as figure 1 shown in the wafer pre-alignment system. Wherein, the wafer pre-alignment system includes: a displacement sensor 1 , a programmable logic controller (not shown in the figure), a stepping driver (not shown in the figure), a stepping motor 2 and a turntable 3 . The stepper driver receives the control signal from the programmable logic controller and drives the stepper motor 2 based on the control signal. The wafer is placed on the turntable 3 controlled by the stepper motor 2 to ro...

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Abstract

The invention relates to a wafer pre-alignment method. The method comprises the following steps: sampling the circumference of a wafer by using a displacement sensor to obtain displacement data of the circumference of the wafer; performing differential processing on the displacement data to obtain a differential result; determining the positions of two end points of a gap or a cut edge of the wafer and the central position of the gap or the cut edge according to the difference result; determining the center offset of the wafer based on the displacement data; determining a deflection angle of the center of the notch or the cut edge relative to a specified position according to the center position of the notch or the cut edge and the center offset; and adjusting the position of the wafer based on the deflection angle and the center offset. According to the method, the pre-alignment of the wafer can be completed by combining the difference result of the acquired displacement data through one-time data acquisition, the consumed time is short, and the calculated amount is small.

Description

technical field [0001] The present application relates to the field of manufacturing technology, in particular to a wafer pre-alignment method, a wafer pre-alignment system and a storage medium. Background technique [0002] Wafer refers to the silicon wafer used to make silicon semiconductor integrated circuits, and its raw material is silicon; the main processing methods of wafers are sheet processing and batch processing, that is, one or more wafers are processed at the same time. In the field of semiconductor product manufacturing, some key equipment needs to pre-align the wafer. [0003] In traditional related technologies, there are many methods for wafer pre-alignment, but most of them are relatively complicated and take a long time for pre-alignment. Contents of the invention [0004] Based on this, it is necessary to provide a wafer pre-alignment method with simple calculation and short time consumption to solve the above technical problems. [0005] A wafer pre...

Claims

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Application Information

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IPC IPC(8): H01L21/68H01L21/67
CPCH01L21/681H01L21/67259
Inventor 芦海朋吴金明何中演田冲高波吴志宏李剑锋高云峰
Owner HANS LASER TECH IND GRP CO LTD
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