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PCB electroplating control method and electroplating system

A control method and PCB board technology, applied in the direction of electrolysis process, electrolysis components, cells, etc., can solve the problem of not being able to achieve good PCB board current uniformity, achieve uniform current density, improve uniformity, and improve the effect of current distribution

Active Publication Date: 2022-02-22
SHENNAN CIRCUITS
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  • Abstract
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  • Claims
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AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a control method and an electroplating system for electroplating PCB boards in view of the above-mentioned defects of the prior art, so as to solve the problem that the current electroplating process cannot achieve uniform current of a good PCB board

Method used

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  • PCB electroplating control method and electroplating system
  • PCB electroplating control method and electroplating system
  • PCB electroplating control method and electroplating system

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Embodiment Construction

[0025] Now in conjunction with the accompanying drawings, the preferred embodiments of the present invention will be described in detail.

[0026] Such as image 3 and Figure 4 As shown, the present invention provides a preferred embodiment of a control method for electroplating a PCB board.

[0027] A kind of control method of electroplating PCB board 10, the step of described control method comprises:

[0028] Step S00, setting two electroplating modes, one electroplating mode is to control the first clamping part 111 to switch to a conductive state and control the second clamping part 112 to switch to a cathode, and the other said electroplating mode is to control the first clamping part The holder 111 is switched to a cathode and the second holder 112 is controlled to switch to a conductive state;

[0029] Step S10, clamping the two pairs of ends of the PCB board 10 by the first clamping part 111 and the second clamping part 112 in the electroplating solution;

[0030...

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Abstract

The invention belongs to the technical field of PCB electroplating, and particularly relates to a PCB electroplating control method and an electroplating system. The control method comprises the following steps: clamping two opposite ends of the PCB in an electroplating solution through the first clamping piece and the second clamping piece; and in the electroplating process, periodically switching the two electroplating modes till that the electroplating operation of the PCB is completed, wherein one electroplating mode is that the first clamping piece is controlled to be switched into the conductive state and the second clamping piece is controlled to be switched into the cathode, and the other electroplating mode is that the first clamping piece is controlled to be switched into the cathode and the second clamping piece is controlled to be switched into the conductive state. The PCB is conducted through one end, the cathode is arranged at the other end, a certain drainage effect is provided, a part of current is absorbed so as to improve current distribution on the PCB, periodic switching is carried out, the current density is made uniform, the current is prevented from being gathered to a sharp corner or an edge, and the current density is prevented from being gradually reduced along with the farther distance.

Description

technical field [0001] The invention provides the technical field of electroplating PCB boards, and in particular relates to a control method and an electroplating system for electroplating PCB boards. Background technique [0002] With the rapid development of the electronics industry, the requirements for PCB boards are getting higher and higher, such as fine lines, impedance control, and even board thickness control, but the existing copper plating process is difficult to achieve good The uniformity of the coating has become the main factor restricting the continuous development of fine lines and impedance control. In addition, nickel-gold, tin and other processes also have a strong demand for improving the uniformity of their coatings. [0003] The electroplating process is a method of covering a conductor with a layer of metal using the principle of electrolysis. Electroplating refers to a surface processing method in which the cations of the pre-plated metal in the pl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D21/12C25D7/00C25D17/06C25D17/00
CPCC25D21/12C25D7/00C25D17/06C25D17/00
Inventor 张利华钱浩许愿袁锡志冷科刘金峰
Owner SHENNAN CIRCUITS
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