Board-to-board connection structure and preparation method thereof
A connection structure and board-to-board technology, which is applied in the direction of electrical connection of printed components, structural connection of printed circuits, and manufacturing of printed circuits, can solve problems that cannot meet the development trend of thin and bendable electronic products, increase the total thickness of circuit boards, etc.
Pending Publication Date: 2022-02-22
AVARY HLDG (SHENZHEN) CO LTD +1
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Problems solved by technology
However, the above-mentioned connection methods are circuit boards connected through a medium between the boards, and the resulting product will increase the total thickness of the circuit board, which cannot meet the development trend of thinner and bendable electronic products.
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[0076] The following will clearly and completely describe the technical solutions in the embodiments of the application with reference to the drawings in the embodiments of the application. Apparently, the described embodiments are only some of the embodiments of the application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.
[0077] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terms used herein in the specification of the application are only for the purpose of describing specific embodiments, and are not intended to limit the application.
[0078] see Figure 1 to Figure 23 , an embodiment of the present application provides a method for prepari...
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The invention discloses a board-to-board connection structure and a preparation method thereof. The board-to-board connection structure comprises a first circuit board and a second circuit board. The first circuit board comprises a first circuit substrate, an adhesive layer and a second circuit substrate which are stacked. The first circuit substrate comprises a first base layer, a first inner side circuit layer and a first outer side circuit layer, the first inner side circuit layer comprises a first connecting pad, and the adhesive layer and the first outer side circuit layer are internally provided with a containing space used for exposing the first connecting pad. The second circuit substrate comprises an insulating layer and second outer side circuit layers. The second circuit substrate is internally provided with a via hole which is electrically connected with the two second outer side circuit layers. The second circuit board comprises a second base layer and third outer side circuit layers arranged on the two opposite surfaces of the second base layer. The third outer side circuit layers comprise second connecting pads. The second circuit board is inserted into the containing space, and the two second connecting pads are respectively communicated with the via hole and the first connecting pad. The problem that the thickness is increased after the circuit board is connected can be solved.
Description
technical field [0001] The present application relates to the technical field of printed circuit boards, in particular to a board-to-board connection structure and a preparation method thereof. Background technique [0002] With the widespread application of printed circuit boards in the electronic field, in order to exert the excellent performance of electronic products, it is usually necessary to connect two or more circuit boards with different functions together. [0003] Traditional connection methods between circuit boards include connection through anisotropic conductive glue (ACF), pulse hot-compression welding (hotbar) connection, board-to-board (BTB) connection, and the like. However, in the above-mentioned connection methods, the circuit boards are connected through a dielectric between the boards, and the resulting product will increase the total thickness of the circuit board, which cannot meet the development trend of thinner and bendable electronic products. ...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H05K1/11H05K1/14H05K3/46
CPCH05K1/11H05K1/144H05K3/4614H05K3/4623H05K3/4697H05K2201/09163H05K3/368H05K1/142H05K3/4652H05K2203/061H05K1/112H05K2203/068H05K1/0298H05K2201/10984H05K2203/041H05K1/092
Inventor 刘瑞武彭满芝
Owner AVARY HLDG (SHENZHEN) CO LTD