Manufacturing method and manufacturing tool for finishing disc small ingot

Abstract

The invention discloses a manufacturing method of a finishing disc small ingot. The manufacturing method comprises the steps of screening diamonds, preparing and placing materials, fixing the materials, placing the diamonds, injecting macromolecular resin, and heating, fixing and forming. The reverse casting process is adopted, the top end alignment effect of the diamonds is better, the number of the diamonds in actual work is far higher than that of a traditional finishing disc, and the finishing efficiency is greatly improved. And meanwhile, the diamond is more tightly adhered and is not easy to fall off, so that the risk of damaging the wafer is reduced. The reverse casting process enables the diamond to be more intact in shape and long in service life, and the cost of a wafer mill can be greatly reduced. The defects of a traditional finishing disc are overcome, and the manufacturing method has wide application prospects.

Description

technical field [0001] The invention relates to the technical field of CMP in the field of semiconductor equipment, in particular to a method for manufacturing a small ingot of a trimming disk. Background technique [0002] Chemical Mechanical Polishing (CMP) is an important step in the manufacturing of various industries, and has been widely used in the manufacture of chips, such as integrated circuits (IC) or dynamic random access memory (DRAM). CMP can planarize the dielectric layer or conductive layer deposited on the chip. It is a key process for smoothing the wafer in semiconductor manufacturing, and it is also the only process technology that can achieve global planarization. In the future, semiconductors will be lighter, thinner, shorter, and smaller, so the CMP process will become more popular and developed. [0003] CMP technology has complex process steps, in which polishing pad and conditioning disc are two necessary components in the CMP system. In the CMP sys...

AI Technical Summary

Problems solved by technology

[0006] 2. Most of the abrasive particles not only do not work, but are easy to block the flow of grinding or scraping

[0007] 3. The excess abrasive particles will fall off, increasing the risk of scratching the wafer

[0008] 4. There are many abrasive grains on the dressing disc, and the cost is high

[0009] To sum up, although the traditional diamond dressing disc is the most efficient correction tool for the CMP process, there are problems such as uneven diamond height, small number of actual work, and high cost in production and use, which need to be resolved.

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