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Wafer splitting method, wafer splitting device, wafer splitting equipment and storage medium

A storage medium and wafer technology, applied in image analysis, image enhancement, instruments, etc., can solve problems such as edge chipping, lower product yield, and wafer deformation cannot be alleviated, so as to reduce extrusion deformation and improve yield rate effect

Pending Publication Date: 2022-02-25
深圳市大族半导体装备科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the wafer is split in its entirety and the unsplit area is relatively large, the deformation of the wafer cannot be alleviated. When the deformation of the wafer increases cumulatively and reaches a certain level, defects such as edge chipping will occur, thereby reducing the quality of the product. Rate

Method used

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  • Wafer splitting method, wafer splitting device, wafer splitting equipment and storage medium
  • Wafer splitting method, wafer splitting device, wafer splitting equipment and storage medium
  • Wafer splitting method, wafer splitting device, wafer splitting equipment and storage medium

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0088] S1: Adhere the wafer 30 on the white film, and place it on the workbench 60, which can realize 270-degree rotation. After the loading is completed, the vision system 50 starts to work and generates cutting line data of the entire wafer 30 .

[0089] S2: Divide the horizontal cutting line data into four parts, such as Figure 7 shown. Wafer 30 has a total of 1000 transverse cutting lines 31, and the result of equal division is that 1-250 cutting lines are the previous partition 71, 251-500 cutting lines are the upper second partition 72, and 501-750 cutting lines are the next partition 73, 751-1000 cutting line is 74 of the second division.

[0090] S3: Setting the splitting sequence of each partition, the splitting sequence is the upper partition 71 , the second lower partition 74 , the next partition 73 and the upper second partition 72 .

[0091] S4: Set the splitting direction of each partition. The splitting direction is 71 cleaves in the upper partition, 74 reve...

Embodiment 2

[0096] S1: Adhere the wafer 30 on the white film, and place it on the workbench 60, which can realize 270-degree rotation. After the loading is completed, the vision system 50 starts to work and generates cutting line data of the entire wafer 30 .

[0097] S2: Divide the horizontal cutting line data into six parts, such as Figure 8 shown. Wafer 30 has a total of 1000 transverse cutting lines 31, 1-166 cutting lines are the upper division 81, 167-332 cutting lines are the upper second division 82, 333-498 cutting lines are the upper third division 83, 499-664 The first cut line is the next division 84, the 665-830 cut line is the next second division 85, and the 831-1000 cut line is the next third division 86.

[0098] S3: Set the splitting sequence of each partition, the splitting sequence is the upper partition 81 , the lower third partition 86 , the lower second partition 85 , the upper second partition 82 , the upper third partition 83 and the next partition 84 .

[009...

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Abstract

The invention discloses a wafer splitting method, a wafer splitting device, wafer splitting equipment and a storage medium. The wafer splitting method comprises the following steps: acquiring distribution data of all parting lines on a wafer; dividing all the segmentation lines on the wafer into a plurality of partitions; setting a splitting mode of each partition according to the characteristics of the wafer; and sending the splitting mode to execution equipment, so that the execution equipment splits the wafer according to the splitting mode. According to the method, the cutting lines on the surface of the wafer are partitioned, the cleaver only splits the cutting lines in a single partition in the splitting process of each partition, the splitting direction and the splitting sequence of each partition can be preferentially selected according to the process effect; in other words, the wafer is firstly divided into smaller units; so that accumulated extrusion deformation generated during splitting is reduced, and the yield of products is further improved.

Description

technical field [0001] The invention relates to the technical field of wafer processing, in particular to a wafer splitting method, device, equipment and storage medium. Background technique [0002] In the manufacturing process of semiconductor components, after the graphics and electrodes are formed on the wafer through the previous process, the laser scribing is performed in the post-process, and then the wafer is separated from the whole wafer by mechanical chopper splitting. open. In the wafer splitting process, first use a laser cutting machine to draw horizontal and vertical cutting lines on the wafer surface, then attach the wafer to an adhesive white film or blue film, and place the wafer on the split On the cleavage stage, combined with the cleavage equipment camera, the wafer is visually aligned. When the riving knife acts on the surface of the wafer, the hammer hits the back of the riving knife. Under the joint action of the riving knife, hammer and splitting p...

Claims

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Application Information

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IPC IPC(8): G06T7/00G06T7/11
CPCG06T7/0004G06T7/11G06T2207/30148
Inventor 陈世隐金鹏周福海关文武陈俊波聂昆深余俊华尹建刚高云峰
Owner 深圳市大族半导体装备科技有限公司