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Communication device

A technology of communication equipment and metal parts, which is applied in the direction of antenna support/installation device, radiating element structure, radiating unit cover, etc., and can solve the problems that cannot be improved systematically and comprehensively

Pending Publication Date: 2022-02-25
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] At present, the methods to reduce the PIM problem mainly focus on the structure and process, such as improving the connection structure form, contact surface state, fastening process, and welding structure process to make the mechanical joint more stable. However, these methods can only Partial optimization, not systematic overall improvement

Method used

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Embodiment Construction

[0055] The terms used in the embodiments of the present application are only used to explain specific embodiments of the present application, and are not intended to limit the present application.

[0056] An embodiment of the present application provides a communication device, which may be a series of devices that may cause passive intermodulation problems, such as an antenna device, a filter, and a coupler.

[0057] In this embodiment of the present application, description will be made by taking the antenna device as the above-mentioned communication device as an example.

[0058] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Apparently, the described embodiments are part of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skill...

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Abstract

The embodiment of the invention provides a communication device which comprises a first metal piece and a second metal piece, a gap exists between the first metal piece and the second metal piece, the gap is coated with a conductive material, so that the conductive material can wrap the gap, electromagnetic waves cannot reach the gap, an intermodulation source is generated, and the PIM problem is solved. Moreover, the conductive material can be fixed at the discontinuous position of any two structural members in a dispensing manner, so that the PIM problem is systematically and comprehensively solved.

Description

[0001] This application claims the priority of the Chinese patent application with the application number 202110622388.9 and the application name "Method for Solving PIM Based on Conductive Adhesive" submitted to the China Patent Office on June 3, 2021, the entire contents of which are incorporated in this application by reference . technical field [0002] The embodiments of the present application relate to the field of wireless communication technologies, and in particular, to a communication device. Background technique [0003] With the rapid development of modern mobile communications, the data and voice data required to pass within a fixed bandwidth are increasing. Since the transmission medium has certain nonlinear characteristics, two or more frequencies will be mixed together in nonlinear devices. A spurious signal is generated—passive intermodulation (PIM) problem. When the passive intermodulation falls within the receiving frequency band of the base station, the...

Claims

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Application Information

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IPC IPC(8): H01Q1/36H01Q1/52H01Q1/24H01Q15/14H01Q1/42H01Q1/50
CPCH01Q1/36H01Q1/526H01Q1/241H01Q15/14H01Q1/50H01Q1/42
Inventor 谢华治郑坤
Owner HUAWEI TECH CO LTD
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