Method for manufacturing multilayer printed wiring board, and multilayer printed wiring board
A manufacturing method and multi-layer printing technology, applied in the manufacture of multi-layer printed wiring boards and the field of multi-layer printed wiring boards, can solve the problem of poor dielectric properties, inability to fully remove resin residues, and inability to ensure the reliability of interlayer connection channels and other issues to achieve the effect of ensuring uniformity
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no. 1 approach
[0053] refer to Figure 3A ~ Figure 3C The process sectional view of the 1st Embodiment demonstrates the manufacturing method of the printed wiring board of 1st Embodiment.
[0054] First, if Figure 3A As shown in (1), a double-sided metal foil laminate 10 is prepared. The double-sided metal foil laminate 10 includes: an insulating substrate 11 ; a metal foil 12 disposed on the upper surface of the insulating substrate 11 ; and a metal foil 13 disposed on the lower surface of the insulating substrate 11 . Metal foils 12 and 13 are formed on insulating base material 11 through a seed layer (not shown) formed on the main surface of insulating base material 11 .
[0055] The material of the insulating base material 11 is not particularly limited. For example, polyimide (PI), modified polyimide (MPI), polyethylene naphthalate (PEN), polyether ether ketone (PEEK), liquid crystal polymer (LCP) and fluorine Resin (PFA, PTFE, etc.). From the viewpoint of reducing the transmissio...
no. 2 approach
[0089] Next, refer to Figure 4A ~ Figure 4D The process sectional view of the 2nd Embodiment demonstrates the manufacturing method of the printed wiring board of 2nd Embodiment. In each figure, the same code|symbol is attached|subjected to the same component as 1st Embodiment. One of the points of difference from the first embodiment is that in the second embodiment, the original material is a single-sided metal foil laminate, and the laminate is laminated not only on the upper surface side but also on the lower surface side. Floor.
[0090] First, if Figure 4A As shown in (1), a single-sided metal foil laminate 10A is prepared. This single-sided metal foil laminate 10A includes an insulating base material 11 and a metal foil 12 provided on the upper surface of the insulating base material 11 . Metal foil 12 is formed on insulating base material 11 through a seed layer (not shown) formed on the main surface of insulating base material 11 .
[0091] Next, if Figure 4A ...
no. 3 approach
[0115] Next, refer to Figure 5A ~ Figure 5D The process sectional view of the 3rd embodiment demonstrates the manufacturing method of the printed wiring board. In each figure, the same code|symbol is attached|subjected to the same component as 1st Embodiment. One of the differences from the first embodiment is that in the third embodiment, the conductive pattern 12a is formed on the adhesive layer.
[0116] First, if Figure 5A As shown in (1), a single-sided metal foil laminate 10B is prepared. The single-sided metal foil laminate 10B includes an insulating base material 11 and a metal foil 13 provided on the lower surface of the insulating base material 11 via an adhesive layer 11a. The adhesive layer 11a has a filler content greater than a prescribed value (for example, 25% by weight). In addition, the filler material of the adhesive layer 11a is the same as the filler material of the adhesive layer 15 demonstrated in 1st Embodiment. The pressure-sensitive adhesive la...
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Abstract
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