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Wafer periphery insulation protection layer spraying device and method

A technology of insulating protective layer and spraying device, which is applied in the direction of spraying device and spray booth, which can solve the problems of insufficient uniformity of insulating protective layer spraying and dead angle of spraying at the clamping position, so as to achieve convenient feeding and feeding, and eliminate the problem of dead angle. strong effect

Pending Publication Date: 2022-03-01
东莞市三创智能卡技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In SIM card processing, it is necessary to process the surface of the wafer. The treatment includes forming an insulating protective layer on the surface of the wafer. However, the spraying of the existing insulating protective layer is not uniform enough, and there is likely to be a dead angle of spraying at the clamping position. Based on this, we now provide a Device and method for spraying insulating protective layer around seed wafer

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  • Wafer periphery insulation protection layer spraying device and method
  • Wafer periphery insulation protection layer spraying device and method
  • Wafer periphery insulation protection layer spraying device and method

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Embodiment 1

[0022] see Figure 1-Figure 4 , in the embodiment of the present invention, a kind of wafer peripheral insulation protective layer spraying device, comprises processing box 11 and several legs that are arranged on its lower end, each leg lower end is all provided with a supporting seat 35, and described processing box 11 The inside is provided with a spraying assembly for spraying the wafer and a clamping assembly for clamping and positioning the wafer. The clamping assembly includes clamping and positioning frames 20 arranged symmetrically on the left and right, and each clamping and positioning frame 20 has a There are two groups of vertically arranged pinch rollers 13, the four pinch rollers 13 are roller body structures with wide ends and a narrow middle, the surface of the pinch rollers 13 is provided with an anti-skid layer, and the pinch rollers 13 The fixed shaft on the top is connected and fixed to the output end of the first motor 12, and the left and right clamping ...

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Abstract

The invention discloses a wafer periphery insulation protection layer spraying device and method.The wafer periphery insulation protection layer spraying device comprises a processing box and a plurality of supporting legs arranged at the lower end of the processing box, a supporting base is arranged at the lower end of each supporting leg, and a spraying assembly used for spraying a wafer and a clamping assembly used for clamping and positioning the wafer are arranged in the processing box; the clamping assembly comprises clamping positioning frames which are symmetrically arranged left and right, each clamping positioning frame is provided with two sets of pressing rollers which are vertically arranged, the four pressing rollers are of roller body structures with the two ends wide and the middle narrow, and anti-skid layers are arranged on the surfaces of the pressing rollers. The whole spraying process is carried out in a closed environment, pollution to the environment is reduced, meanwhile, a clamping assembly capable of adjusting the machining angle is constructed, the problem of dead angles existing in clamping can be solved, turning-over operation can be carried out, the machining efficiency is effectively improved, and practicability is high.

Description

technical field [0001] The invention relates to the technical field of wafer processing, in particular to a device and method for spraying an insulating protective layer around a wafer. Background technique [0002] Wafers produced by semiconductor manufacturing process can be widely used in various application fields. The yield rate of the wafer can directly determine the quality of the end product. Why do chips in any application field have to go through multiple processing processes before they can obtain practical electronic components or optoelectronic components? Chips are also used in SIM cards. SIM cards are the key for GSM mobile phones to connect to the GSM network. If the SIM card is pulled out from the mobile phone, the mobile phone will not be able to enjoy various services provided by the network operator except for emergency calls. In addition to being used as a key, the SIM card also provides users with a lot of convenience. Users only need to insert or emb...

Claims

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Application Information

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IPC IPC(8): B05B16/00B05B13/02
CPCB05B16/95B05B13/0285B05B13/0228B05B13/0271
Inventor 刘瑛罗鸿耀吴京都
Owner 东莞市三创智能卡技术有限公司