Device and method for adding copper balls or tin balls in electroplating line of printed board

Abstract

The invention discloses an adding device and adding method for copper balls or solder balls in a printed board plating line, and the adding device comprises a lead-in wire groove for leading in the copper balls or the solder balls, a plurality of adding grooves which are arranged at the lower end of the lead-in wire groove at intervals and are sequentially arranged from front to back, and a plurality of plate turning mechanisms which are correspondingly arranged at the rear sides of the adding grooves one by one, a through hole for a copper ball or a tin ball to penetrate through up and down is formed in the adding groove in a penetrating mode, an opening communicated with the through hole is formed in the position, corresponding to the adding groove, of the lead-in wire groove, and the turning plate mechanism is used for closing or opening the opening. According to the adding device, automatic adding of the copper balls or the tin balls is achieved, the situation that the whole bag of copper balls or tin balls need to be manually carried to corresponding groove bodies of a production line each time during adding is avoided, the labor intensity of workers is reduced, and the adding efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a device and method for adding copper balls or tin balls in a printed board electroplating line. Background technique [0002] During the production process of printed circuit boards, the production line of the pattern electroplating process needs to add copper balls / solder balls regularly to ensure sufficient anode materials. The industry usually adopts manual adding methods when adding, which increases the work intensity of employees and is prone to copper balls / solder balls Missing, inconvenient to manage problems. [0003] Existing practices have the following drawbacks: [0004] 1. Since the copper ball / solder ball additive material is designed to be spherical in shape, the problem of copper / solder ball slipping and loss is likely to occur during the adding process. [0005] 2. Before adding copper balls / tin balls, it is necessary to manually move the whol...

AI Technical Summary

Problems solved by technology

[0004] 1. Since the copper ball / solder ball additive material is designed to be a sphere, the problem of copper / solder ball slipping and loss is likely to occur during the adding process

[0005] 2. Before adding copper balls / tin balls, it is necessary to manually move the whole bag of copper balls / tin balls to the trolley, and then move each bag of copper balls / tin balls on the trolley to the corresponding tank, and finally take a few copper balls each time. Balls / solder balls are manually placed into the titanium basket on the side wall of the tank body. The adding work is cumbersome and the work intensity is high. At the same time, it is prone to dissatisfaction with the titanium basket; it affects the adding efficiency and wastes costs.

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