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Method for improving LTCC interlayer alignment precision and preparation method of LTCC chip device

A technology of alignment accuracy and green ceramic sheet, which is applied in semiconductor/solid-state device manufacturing, electric solid-state devices, semiconductor devices, etc., can solve the problems of size asymmetry, ceramic block expansion, etc. The effect of small size changes

Pending Publication Date: 2022-03-01
SUZHOU R&D CENT OF NO 214 RES INST OF CHINA NORTH IND GRP
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  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

However, after lamination, the green ceramic block will expand, and the relative positions of the printed back pads after lamination and the front pads printed before lamination are offset. If cutting is based on the front pads, the pads on both sides of the back The size will be asymmetric, such as figure 2 shown

Method used

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  • Method for improving LTCC interlayer alignment precision and preparation method of LTCC chip device
  • Method for improving LTCC interlayer alignment precision and preparation method of LTCC chip device
  • Method for improving LTCC interlayer alignment precision and preparation method of LTCC chip device

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Embodiment Construction

[0036] The present invention will be further described below. The following examples are only used to illustrate the technical solution of the present invention more clearly, but not to limit the protection scope of the present invention.

[0037] The invention provides a method for improving the alignment accuracy between layers of LTCC. The graphics with higher alignment accuracy requirements on two adjacent layers are printed on the front and back sides of the same piece of green porcelain, and the same printing is used for the front and back printing. Alignment marks to eliminate the influence of positioning pins and punching accuracy on the alignment accuracy between layers.

[0038] see image 3 , defining layers A and B as two adjacent layers, a method to improve the alignment accuracy between LTCC layers The specific implementation process is as follows:

[0039] 1) Use 4 sets of through holes to make Mark points in the non-graphic area of ​​the four corners of the g...

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Abstract

The invention provides a method for improving the interlayer alignment precision of LTCC and a preparation method of an LTCC chip device, and the alignment method comprises the steps: printing two adjacent layers of patterns with higher alignment precision requirements on the front and back surfaces of the same piece of raw ceramic, employing the same printing aligner during the printing of the front and back surfaces, eliminating the influence of positioning pins and punching precision on the interlayer alignment precision, and improving the alignment precision of the LTCC chip device. And the interlayer alignment precision of adjacent layers of the LTCC substrate is improved.

Description

technical field [0001] The invention relates to a method for improving alignment accuracy between LTCC layers and a preparation method for LTCC chip devices, belonging to the technical field of integrated circuit processing. Background technique [0002] LTCC uses laser drilling, hole filling, precision conductive paste printing and other processes to produce the required circuit patterns on the green ceramic film tape, and then laminates the multi-layer green ceramic sheets together and fires them under a specific sintering curve. multilayer ceramic substrates. Such as figure 1 As shown, the LTCC lamination process is to punch a number of positioning holes around the green ceramic film belt, and stack the green ceramic film belt layer by layer on the lamination table with pins in a certain order. The alignment accuracy of the interlayer graphics is affected by the positioning. The influence of pins, punching accuracy, and deformation of raw porcelain when manually peeling...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/544H01L21/48
CPCH01L23/544H01L21/4846H01L21/4867
Inventor 薛峻贺彪宋哲宇丁伟民
Owner SUZHOU R&D CENT OF NO 214 RES INST OF CHINA NORTH IND GRP
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