45results about How to "Reduce size change" patented technology

A gate electrode of one of an nFET and a pFET includes a metal-containing layer in contact with a gate insulating film and a first silicon-containing layer formed on the metal-containing layer, and a gate electrode of the other FET includes a second silicon-containing layer in contact with a gate insulating film and a third silicon-containing layer formed on the second silicon-containing layer. The first silicon-containing layer and the third silicon-containing layer are formed by the same silicon-containing material film.

A fuel cell stack includes a box-shaped casing and a stack body in the box-shaped casing. The stack body is formed by stacking a plurality of unit cells. The casing includes end plates, a plurality of side plates, angle members, and coupling pins. The angle members couple adjacent ends of the side plates. The coupling pins couple the end plates and the side plates.

An image-taking apparatus generates an output image from a photographed image obtained by photographing and displays this output image on a display screen of a display section. The image-taking apparatus includes a recognition processing section for recognizing a specific subject (facial region of a person, or a facial component such as eyes) included in the photographed image. Referring to results of this recognition, the image-taking apparatus evaluates the dimension of the specific subject in each photographed image. If the dimension evaluated is relatively large, a relatively small magnification ratio to be employed upon the generation of the output image from the photographed image is provided. If the dimension evaluated is relatively small, a relatively large magnification ratio to be employed upon the generation of the output image from the photographed image is provided. As a result, the dimension of the specific subject in the output image is kept substantially constant.

A gas dynamic pressure bearing comprises a shaft, a sleeve whose inner peripheral surface is opposed to an outer peripheral surface of the shaft through a micro-gap, and a substantially cylindrical hub which applies a surface pressure to an outer side of the sleeve and which is fitted to the sleeve, and at least one of the outer peripheral surface of the shaft and the inner peripheral surface of the sleeve is formed with a dynamic pressure generating groove, and if linear expansion coefficients of the shaft, the sleeve and the hub are defined as a₀, a₁ and a₂, respectively, a relation of a₁<α₀<α₂ is satisfied.

A mask includes a silicon member, and a portion defining an opening penetrating the silicon member; and the corner of the opening is rounded.

A manufacturing method for silicon substrates for a magnetic recording medium has the steps of forming a stack body of a number of silicon substrates which are stacked via spacers therebetween, wherein each silicon substrate has a circular hole at a center of the substrate; immersing the stack body of the silicon substrates in a polishing liquid in which grains are suspended; and polishing inner peripheral end faces of the circular holes of the silicon substrates, wherein in polishing, a polishing brush contacts the end faces while performing a relative rotation between the end faces and the polishing brush, and the stack body of the silicon substrates is inverted during polishing. The step of polishing the inner peripheral end faces may be performed before inner and outer peripheries of the silicon substrate are subjected to chamfering. Preferably, the polishing brush is made of polyamide resin.

An object is to improve the wear resistance of a mold part and improve accuracy of disc substrates. A disc-molding mold comprises a first mold including a first support plate and a first mirror-surface disc attached to the first support plate; and a second mold including a second support plate and a second mirror-surface disc attached to the second support plate. A sliding surface of a mold part disposed on one of the first and second molds is treated by means of low-temperature nitriding. In this case, since the mold part is treated by means of low-temperature nitriding, the wear resistance of the mold part can be improved. In addition, since the treatment temperature is low, even when low-temperature nitriding is performed on a mold part which is complicated in shape, the mold part does not deform, and its dimensional variation can be decreased.

The invention discloses a melting compound process for abrasion-resistant layers of a scraper plate conveyor and the scraper plate conveyor with the abrasion-resistant layers. The scraper plate conveyor comprises a bottom plate, a middle plate and an E-shaped ledge. The bottom plate, the middle plate and the E-shaped ledge are all provided with the abrasion-resistant layers. The melting compound process for the abrasion-resistant layers comprises the steps that firstly, the middle plate is horizontally arranged on the upper face, and the upper surface of the middle plate is pressed by a pressing plate and faces upwards; secondly, welding machine parameters are adjusted; and finally, surfacing is conducted, specifically, the welding machine runs in the width direction of the middle plate and then runs in the length direction of the middle plate, and a continuous melt plated band is formed through sequential cycles. The middle plate, the bottom plate and the E-shaped ledge of the scraper plate conveyor are provided with the abrasion-resistant layers, so that the abrasion resistance of the scraper plate conveyor is improved. Meanwhile, through melting compound of the abrasion-resistant layers, the abrasion-resistant layers subjected to melting compound is even in thickness, low in cost and good in application effect.

Apparatus and method for use in firing a ceramic casting core includes a saggar and a core setter insert disposed in the saggar. The core setter insert can be disposed on a refractory particulate grog bed and/or refractory supports inside the saggar on a bottom wall of the saggar. The core setter insert has a core-receiving surface, which can have an airfoil shape to receive an airfoil-shaped ceramic casting core used in casting hollow airfoil castings.

The present invention provides a plasma etching method with an EUV-exposed resist capable of preventing variations of device feature dimensions. The plasma etching method of the present invention is to plasma-etch a target material with a multilayer resist that serves as a mask and composed of an EUV-exposed resist, an antireflective coating, an inorganic film and an organic film. The plasma etching method includes a first step of depositing a deposition film on a surface of the EUV-exposed resist before the antireflective coating is etched, a second step of etching the deposition film deposited on the antireflective coating and the antireflective coating with a gas mixture of Cl₂ gas, HBr gas and N₂ gas after the first step, a third step of etching the inorganic film after the second step, and a fourth step of etching the organic film after the third step.

To provide a quartz glass tool, for silicon wafer heat treatment, having a transparent grooving face, which is free from the deposition of particles of a transition metal element foreign material derived from glass dust or diamond blade produced by breakdown of acute irregularities based on opening of very small concaves and convexes and microcracks, causes no significant change in dimension also in cleaning with hydrofluoric acid, and can maintain a high degree of cleanness even after use of a long period of time, and to provide a process for producing the same. A quartz glass tool for silicon wafer heat treatment, comprising a wafer mounting member having a grooving face formed by machining, characterized in that the whole grooving face of the wafer mounting member is transparent, the surface roughness is 0.03 to 0.3 μm in terms of center line average roughness (Ra) and 0.2 to 3.0 μm in terms of maximum roughness (Rmax), and a change in center line average roughness and maximum roughness after etching with a 5% aqueous hydrogen fluoride solution for 24 hr is not more than 50%. A process for producing a quartz glass tool for silicon wafer heat treatment, comprising roughly machining a wafer mounting member with a diamond blade having a rough particle size, conducting remachining with a diamond blade having a finer particle size than the above diamond blade, and then subjecting the inside of the groove to firing finishing.

An alignment tool is disclosed for connection to a work component and for use in aligning the work component with a work piece to establish a repeatable set up for cutting or routing of the work piece, and wherein the alignment tool provides for parallel and square alignment of the work component relative to first and second edges of the work piece that are perpendicular to each other. Use of the parallel and square alignment tool aligns the work component for an operation parallel to the second edge of the work piece and the operation may be conveniently repeated on further work pieces without need to measure and mark the work pieces. Optional use of first and second parallel and square alignment tools along opposed second and third edges of a work piece that are perpendicular to a first edge provides for greater accuracy for operations having a greater length.

The invention provides a method for improving the interlayer alignment precision of LTCC and a preparation method of an LTCC chip device, and the alignment method comprises the steps: printing two adjacent layers of patterns with higher alignment precision requirements on the front and back surfaces of the same piece of raw ceramic, employing the same printing aligner during the printing of the front and back surfaces, eliminating the influence of positioning pins and punching precision on the interlayer alignment precision, and improving the alignment precision of the LTCC chip device. And the interlayer alignment precision of adjacent layers of the LTCC substrate is improved.

The invention discloses a method for improving performance of a bearing bush steel backing. The method comprises the following steps that S1, rolling treatment is conducted, specifically, a platy bearing bush raw material passes through a gap between a pair of rotating rollers, the platy bearing bush raw material is compressed by the rollers, and thus the section of the platy bearing bush raw material is reduced; S2, press-bending shaping is conducted, specifically, the rolled platy bearing bush raw material is bent in a pressed mode through a bending press, and thus the rolled platy bearing bush raw material is in a semicircular shape; and S3, low-temperature heat treatment is conducted, specifically, the platy bearing bush raw material subjected to press-bending shaping is put into a heat treatment machine to be heated, after heating, dimensional processing and coating treatment are conducted, and thus a finished bearing bush is obtained. According to the method for improving the performance of the bearing bush steel backing, the hardness of the bearing bush steel backing can be adjusted and improved, the deformation stability of the bearing bush is improved, by controlling the hardness of the steel backing, the design requirement is met, the dimensional change amount of the bearing bush is decreased, the stability of assembly and operation is improved, and the problem that the strength of an existing bearing bush steel backing is low, consequently, the bearing bush steel backing is prone to deforming in the assembly and operation processes, and normal use is affected issolved.