Active interconnection base material for high-efficiency high-power LED flip chip

A flip-chip, high-power technology, applied in the direction of positioning device, feeding device, positioning device, etc., can solve the problem of hand cutting, etc., and achieve the effect of reducing noise pollution

Pending Publication Date: 2022-03-04
江苏康芯微电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the production process of stainless steel in the prior art, the material needs to be cut, and usually personnel are required to manually push the material to the bottom of the cutting device, and it is easy to accidentally cut the material

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0020] Embodiment: An active interconnect substrate for high-efficiency and high-power LED flip-chips, including a support frame 1 and an operating platform 2 fixedly connected to the support frame 1. A fixed L-shaped structure is welded on the operating platform 2 near the edge. Frame 3, the side of fixed frame 3 facing the operation platform 2 is fixedly connected with a motor-driven cutting knife 4, the operation platform 2 is provided with a servo motor 5 near the fixed frame 3, and the output end of the servo motor 5 is connected with a rotating shaft for coaxial rotation 6. A stay cord 7 is wound around the rotating shaft 6, and the other end of the stay cord 7 is installed with a fixing device 8 for fixing the object. The fixing device 8 includes a base plate 81, a threaded rod 82, a nut 83 and a pressure plate 84. The base plate 81 is placed on On the operating platform 2, the bottom plate 81 is connected with the stay rope 7, two threaded rods 82 are respectively conne...

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PUM

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Abstract

The invention discloses an active interconnection base material for a high-efficiency high-power LED flip chip, which is applied to the technical field of cutting equipment, and is characterized in that the active interconnection base material comprises a support frame and an operation platform arranged on the support frame, and a fixing frame of an L-shaped structure is arranged on the operation platform close to the edge; a cutting knife driven by a motor is arranged on the side, facing the operation platform, of the fixing frame. A servo motor is arranged on the operation platform close to the fixing frame. The cutting device has the technical effects that materials can be conveniently and quickly cut off, and the possibility that hands are injured when being cut by a cutting knife is reduced.

Description

technical field [0001] The invention relates to the technical field of chip interconnection materials, in particular to an active interconnection substrate for high-efficiency and high-power LED flip chips. Background technique [0002] Stainless steel is the abbreviation of stainless and acid-resistant steel. Steel grades that are resistant to weak corrosive media such as air, steam, and water, or have stainless properties are called stainless steel; and steel grades that are resistant to chemical corrosion media are called acid-resistant steel. [0003] In the production process of stainless steel in the prior art, materials need to be cut, and personnel are usually required to manually push the materials to the bottom of the cutting device, which is easy to accidentally cut by hand. Contents of the invention [0004] The object of the present invention is to provide an active interconnect substrate for high-efficiency and high-power LED flip-chips, which has the advanta...

Claims

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Application Information

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IPC IPC(8): B23D79/00B23Q3/06B23Q11/00B23Q11/12B21D43/28B21D43/04B21D43/02
CPCB23D79/00B23Q3/06B23Q11/126B23Q11/0096B21D43/04B21D43/023B21D43/28
Inventor 王兴志
Owner 江苏康芯微电子科技有限公司
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