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Joint of electronic or photoelectric element and manufacturing process thereof

A technology for electronic components and brazing joints, which is applied in the packaging field of electronic components and can solve problems such as high insertion loss

Pending Publication Date: 2022-03-04
SCHOTT AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the disadvantage is that such a large distance between the pin and the base will result in high insertion loss
However, it is not possible to minimize the distance between the opening and the base, as this would result in a distance between the base and the pin that is too small to place the abutment between the base and the pin when the pin is at its minimum position

Method used

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  • Joint of electronic or photoelectric element and manufacturing process thereof
  • Joint of electronic or photoelectric element and manufacturing process thereof
  • Joint of electronic or photoelectric element and manufacturing process thereof

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0034] figure 1 is a side perspective view of a joint 1 according to one embodiment.

[0035] figure 1 The shown joint 1 comprises a base 3 with two or more electrical feedthroughs 5 . The feedthrough 5 is used to pass electrical signals into or out of the connector 1 . Each feedthrough 5 comprises a feedthrough pin 6 extending through and electrically insulated from the base 3 . To this end, the base 3 comprises a hole or opening 8 filled with an insulating material, preferably glass, into which the feedthrough pin 6 is fixed. Two bases 7a, 7b are connected to the base 3 and protrude from the base 3 . Usually, not limited to figure 1 In the shown embodiment, the joint 1 comprises at least one base 7 . Preferably, however, a joint 1 with at least two bases 7a, 7b can be provided, for example for joints comprising laser chips, especially DMLs, in many cases the laser driver IC drives the DML with a differential signal, which means Connector 1 requires two signal wires or...

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Abstract

A connector (1) for an electronic component, the connector (1) comprising a base (3) having at least one feed-through (5) and at least one base (7, 7a) connected to the base, the feed-through (5) comprising a feed-through pin (6) extending through the base (3) and electrically insulated from the base (3), the base (7, 7a) comprising a base station (9) connected to the base (7), wherein the susceptor (7, 7a) is joined to the base (3) via a susceptor substance-substance bond (24).

Description

technical field [0001] The present invention generally relates to the packaging of electronic components. In particular, the invention relates to the design of headers, preferably transistor case (TO) headers, for mounting electronic or optoelectronic devices. The invention is particularly applicable to laser diodes as electronic or optoelectronic devices. However, the present invention relates to an electronic package for any electronic component in which submounts for electrical connection to feedthrough pins are arranged and attached to a base. Background technique [0002] For example, for some optoelectronic applications, precise control of the wavelength of the beam emitted by the laser chip is required since the wavelength of the laser is temperature dependent. Therefore, the temperature of the laser should be stabilized within a narrow temperature range. To achieve this, it is known to use a thermoelectric cooler (TEC), which may be included within the housing of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01S5/02345H01S5/0237H01S5/024
CPCH01S5/02345H01S5/0237H01S5/02415H01L23/045H01S5/02212H01S5/023
Inventor O·W·李J·D·谭A·S·L·萍A·克劳斯A·奥尤都马萨克K·德勒格米勒
Owner SCHOTT AG