Device for realizing vacuum reflow soldering high-temperature uniformity and processing method thereof

Abstract

The invention discloses a device for realizing vacuum reflow soldering high-temperature uniformity and a processing method thereof, and relates to the technical field of vacuum reflow soldering. Vapor-phase liquid in the vapor-phase liquid storage tank is filtered by the first filter through the circulating pump and then injected into the vacuum cavity through the injection valve, the vapor-phase liquid reaches the boiling point through the heating effect of the cavity wall of the vacuum cavity, high-temperature steam is generated, the high-temperature steam is used for heating products in the cavity, and the products in the cavity are heated. Stopping heating when the product temperature reaches the liquid boiling point and the saturated steam temperature; and the vacuum cavity is vacuumized again through the vacuumizing pipeline, and after the saturated steam in the vacuum cavity is condensed and filtered through the condensation filter, the saturated steam recovers to be in the liquid state, and vapor-phase liquid flows back into the vapor-phase liquid storage tank. The heat transfer efficiency is higher, overheating is avoided, and the heat accessibility is good. And the vapor-phase liquid can be condensed and recycled through a vacuumizing pipeline for reuse. Products welded through the technology are high in reliability, free of cavities in welding spots, high in assembly density, high in vibration resistance and good in high-frequency characteristic.

Description

technical field [0001] The invention relates to the technical field of vacuum reflow soldering, in particular to a device for realizing high temperature uniformity of vacuum reflow soldering and a processing method thereof. Background technique [0002] With the mass application of BGA, CBGA, QFN and other complex devices and the sharp increase in the assembly density of printed boards, the problem of soldering quality has become more prominent. The traditional vacuum reflow soldering process in the SMT industry simply uses hot air circulation for heating. Although it can achieve a low soldering void rate, it also has low heating efficiency, poor temperature uniformity of various components of complex products, and no vacuum in the vacuum chamber. Defects such as independent heating. After the product is welded, there are the following problems: (1) There are many problems of virtual welding; (2) The heating rate is slow; (3) The welding process is uncontrollable. Content...

AI Technical Summary

Problems solved by technology

It can effectively solve the temperature uniformity problem of BGA, CBGA, QFN and other complex devices and printed boards with high assembly density under the requirement of low solder void rate

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