Wafer fixing device and wafer drying device

Abstract

The invention discloses a wafer fixing device and a wafer drying device.The wafer fixing device comprises a bottom supporting piece, a plurality of clamping jaws are arranged on the peripheral side of the bottom supporting piece at intervals, and clamping parts used for abutting against the edge of a wafer are formed on the clamping jaws; the clamping jaw is provided with a dredging hole, and the dredging hole is formed in a penetrating mode from the clamping portion of the clamping jaw to the outer side. The dredging holes can guide fluid to be discharged so as to restrain the fluid from staying at the wafer or the clamping jaw.

Description

technical field [0001] The invention belongs to the technical field of wafer post-processing, and in particular relates to a wafer fixing device and a wafer drying device. Background technique [0002] Chemical Mechanical Polishing (CMP) is an ultra-precision surface processing technology for global planarization in integrated circuit (Integrated Circuit, IC) manufacturing. With the development of integrated circuit manufacturing technology, the control of wafer surface defects is becoming more and more stringent. During the wafer manufacturing process, the surface of the wafer will absorb pollutants such as particles or organic matter to generate a large number of defects, which require post-processing to remove these defects. In particular, chemical reagents and abrasives used in large quantities in chemical mechanical polishing will cause contamination on the surface of the wafer, so after polishing, a post-treatment process is required to remove pollutants on the surfac...

AI Technical Summary

Problems solved by technology

Under some working conditions, the particles at the contact between the jaws and the wafer usually adhere to the side of the jaws due to the capillary effect, and the fluid cannot be quickly drained from the engaging part of the jaws, resulting in poor drying of the wafers

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