Chip clamping device suitable for ultralow temperature environment

Abstract

The invention discloses a chip clamping device suitable for an ultra-low temperature environment. The chip clamping device suitable for the ultra-low temperature environment comprises a supporting assembly, a clamping assembly and a clamping assembly, the bearing assembly is mounted at the upper end of the supporting assembly, and the bearing assembly is provided with a bearing surface for bearing a chip; the chip baffle is arranged on the bearing surface; the sliding upper plate is arranged on the bearing surface, the position of the sliding upper plate relative to the chip baffle is adjusted, and the sliding upper plate is suitable for being matched with the chip baffle to clamp the chip; the supporting assembly, the bearing assembly, the chip baffle and the sliding upper plate are all cold-resistant material pieces, and the supporting assembly and the bearing assembly are each provided with a low-temperature medium circulation channel. According to the technical scheme, the chip clamping device composed of the supporting assembly, the bearing assembly, the chip baffle and the sliding upper plate is used, the structure is simple, clamping of chips of different sizes can be achieved, cost is reduced, and the chip clamping device can be immersed into a low-temperature medium and is not prone to damage due to the fact that the low-temperature-resistant material is used.

Description

technical field [0001] The invention relates to the technical field of chip testing, in particular to a chip clamping device suitable for ultra-low temperature environments. Background technique [0002] In the semiconductor chip production process, chip testing is an important process. After the chip is manufactured, use the probe to make stable physical contact with each pad on the chip to test its electrical parameter characteristics. The chip is marked and removed in the subsequent process to improve the yield. Chips for different purposes require different testing environments, such as high temperature, high pressure, low temperature or ultra-low temperature environments. Existing chip testing equipment uses a vacuum chuck or a motor drive mechanism as the fixture of the actuator, which has the problems of high manufacturing or purchase costs for parts and cannot be directly applied to low-temperature and ultra-low temperature conditions. In order to meet the low temp...

AI Technical Summary

Problems solved by technology

[0003] The invention provides a chip clamping device suitable for an ultra-low temperature environment, which is used to at least solve the problems in the prior art that the chip test fixture has high cost and cannot be immersed in a low-temperature medium

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