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Fanout signal line electric heating simulation method

A simulation method and signal line technology, applied in design optimization/simulation, electrical digital data processing, special data processing applications, etc., can solve panel or integrated circuit reliability problems, large heat generation and other problems, and achieve accurate evaluation of reliability. , the effect of optimizing the design

Pending Publication Date: 2022-03-15
成都华大九天科技有限公司
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AI Technical Summary

Problems solved by technology

[0002] In flat panel display design and integrated circuit design, the circuit control signal and power signal are transmitted from the external power control unit to the inside of the integrated circuit through the Fanout signal line. Due to the large current flowing through the power line, the Fanout metal wiring will generate a large Power, thus forming a heat source with large heat generation, causing reliability problems of the entire panel or integrated circuit

Method used

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  • Fanout signal line electric heating simulation method
  • Fanout signal line electric heating simulation method
  • Fanout signal line electric heating simulation method

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Embodiment Construction

[0036] The preferred embodiments of the present invention will be described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.

[0037] In the embodiment of the present invention, first, electrical simulation: extraction of resistance, and simulation of signal line graphics according to input conditions, to obtain accurate electrical index values ​​for all positions of Fanout graphics; then, thermal simulation: establishment of a hybrid heat transfer model close to the actual test environment And calculate the temperature value of all positions of the signal line.

[0038] figure 1 For the flow chart of the electrothermal simulation method of Fanout signal line according to the present invention, reference will be made below figure 1 , the fanout signal line electrothermal simulation method ...

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Abstract

A Fanout signal line electrothermal simulation method comprises the following steps: 1) extracting a parasitic resistance value corresponding to each grid path, and calculating electrical index values corresponding to all positions of a Fanout graph in combination with bias source information; 2) establishing a hybrid heat conduction simulation model according to the semiconductor process information; 3) simulating a heat convection coefficient by using the heat convection simulation model to obtain the influence of the air convection velocity on heat transfer; 4, the electrical index values are simulated through the mixed heat transfer model, and Fanout temperature distribution.By means of the Fanout signal line electric heating simulation method, Fanout temperature distribution conforming to the actual situation can be simulated, and integrated circuit designers and panel designers can accurately evaluate the reliability of products and optimize design.

Description

technical field [0001] The invention relates to the technical field of automatic design of conductor integrated circuits, in particular to the technical field of back-end electrothermal simulation of integrated circuit design. Background technique [0002] In flat panel display design and integrated circuit design, the circuit control signal and power signal are transmitted from the external power control unit to the inside of the integrated circuit through the Fanout signal line. Due to the large current flowing through the power line, the Fanout metal wiring will generate a large Power, thus forming a heat source with large heat generation, causing reliability problems of the entire panel or integrated circuit. In order to evaluate the reliability of the Fanout signal line and improve the heat generation of the signal line, it is necessary to conduct electrothermal simulation on the Fanout line separately, and adjust the circuit line design through the simulation results t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F30/23G06F30/394G06F111/10G06F119/02G06F119/08
CPCG06F30/23G06F30/394G06F2111/10G06F2119/08G06F2119/02
Inventor 童振霄李相启陆涛涛刘伟平
Owner 成都华大九天科技有限公司
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