Preparation method of display module and display panel
A display panel and display module technology, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of copper layer warping and fracture, and achieve the effect of solving copper layer warpage or fracture and good ultraviolet shielding effect
Pending Publication Date: 2022-03-15
SHENZHEN CHINA STAR OPTOELECTRONICS TECH CO LTD
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Problems solved by technology
[0005] The embodiment of the present application provides a method for preparing a display module and a display panel, which solves the problem that the copper layer is easily warped or broken after the protective film is removed during the preparation of the display module.
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[0039] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Apparently, the described embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts belong to the scope of protection of this application.
[0040] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation indicated by rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc. The positional relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the a...
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Abstract
The invention provides a preparation method of a display module and a display panel. The preparation method of the display module is applied to the display panel, the display panel comprises a display area and a bonding area, a glass substrate is provided, the glass substrate comprises a first area corresponding to the display area and a second area corresponding to the bonding area, the first area is provided with an array substrate, and the second area is provided with metal wires; a first protective film and a second protective film are attached to the outer side of the array substrate and the outer side of the glass substrate respectively; first protection glue is arranged on the sides, close to the metal wires, of the array substrate, the first protection film and the second protection film, and the first protection glue comprises VU glue and nanometer rutile type titanium dioxide powder; a copper layer is arranged on the outer side; performing laser cutting on the copper layer to separate the first protective film and the second protective film from the copper layer in the bonding area; and separating the second protective film from the array substrate, and separating the first protective film from the glass substrate. According to the embodiment of the invention, the problem that the copper layer is broken when the protective film is removed is solved.
Description
technical field [0001] The present application relates to the field of display technology, in particular to a method for preparing a display module and a display panel. Background technique [0002] At present, the mainstream display method in the market is LCD screen, and people's demand for various large-size and super-large-size display screens is also increasing. The screen size is below 65 inches. In order to achieve a larger-sized display effect, the mainstream solution on the market is to achieve a large-screen display effect by splicing multiple smaller-sized LCD screens. [0003] As for the narrow frame process required for the seamless splicing of Mini / Micro LEDs, one of the back bonding process routes is to use PVD film formation to form a 1-3 micron thick copper layer on the front, side, and back of the glass substrate. , use the laser engraving process to engrave the copper layer into a pattern that matches the Bonding Lead, realize the connection between the ...
Claims
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IPC IPC(8): H01L33/62H01L27/15H01L33/54
CPCH01L33/62H01L27/15H01L33/54
Inventor 史金明
Owner SHENZHEN CHINA STAR OPTOELECTRONICS TECH CO LTD