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Heat dissipation structure and heat dissipation method

A heat dissipation structure and heat dissipation plate technology, which is applied in the construction of electrical equipment components, modification through conduction heat transfer, cooling/ventilation/heating transformation, etc., can solve the problem of small heat dissipation area of ​​radiators, unused space, equipment damage, etc. problem, to achieve the effect of simple structure, good effect, and improved heat dissipation performance

Inactive Publication Date: 2022-03-15
福州长基生态农业科技发展有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] As we all know, too high temperature will cause certain damage to most non-high temperature equipment, such as LED, solar battery or computer CPU, etc., because the temperature itself will rise during operation, if it is not dissipated in time and effectively, it will lighten to a certain extent The efficiency will drop, and the equipment will burn out. In this case, radiators are often used as auxiliary equipment to dissipate heat. Radiators are generally composed of heat dissipation structures and other auxiliary structures. In the prior art, heat sinks in heat dissipation structures are mostly rectangular. Moreover, the size of each heat sink is the same, and the space is not well utilized, resulting in a small heat dissipation area of ​​the heat sink and low heat dissipation efficiency

Method used

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  • Heat dissipation structure and heat dissipation method
  • Heat dissipation structure and heat dissipation method
  • Heat dissipation structure and heat dissipation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] The bottom surface of the heat dissipation plate is arranged on the top surface of the heat conduction plate, and the heat conduction holes abut against the top surface of the heat conduction plate or extend into the heat conduction plate at their bottom ends, and the extending depths are different. After the heat conduction hole is vacuumed, heat-expandable heat conduction liquid is stored inside, preferably mercury or ethanol.

[0030] when using it:

[0031] After the heat conduction plate absorbs the external heat, part of the heat is directly transferred to the heat sink body and dissipated through the heat sink; the other part of the heat is transferred to the heat transfer fluid, which expands along the heat conduction hole when heated, and conducts the heat to the middle or top of the heat sink to accelerate the heat dissipation. divergence. If alcohol is used, some of the heat will be absorbed by the alcohol, and the alcohol will enter the heat conduction hole...

Embodiment 2

[0034] The heat dissipation plate is arranged on the top surface of the heat conduction plate through the liquid storage chamber placed at the bottom thereof, and the liquid storage chamber is connected with the heat conduction hole. The heat conduction hole and the liquid storage cavity are vacuumized, and heat conduction fluid expandable by heating is stored inside, preferably ethanol.

[0035] Compared with embodiment 1, the heat dissipation principle of embodiment 2 is less heat conduction through direct plate-to-plate contact. Instead, after the heat conduction plate conducts heat, a large area of ​​ethanol is heated and evaporated, and then the gaseous ethanol contacts the bottom surface of the heat dissipation plate to conduct heat, and a small part of the gaseous ethanol enters the heat dissipation holes to dissipate heat.

Embodiment 3

[0037] Based on the structure of Embodiment 2, the bottom ends of the heat conduction holes are connected to the liquid storage cavity through the extension tubes, and the lengths of the extension tubes are different.

[0038] Embodiment 3 is based on the structure of Embodiment 2. Through the extension tube, part of the alcohol expanded by heat is introduced into the heat dissipation plate in advance to dissipate heat, so as to improve heat dissipation efficiency.

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Abstract

The invention discloses a heat dissipation structure and a heat dissipation method. The heat dissipation structure comprises a heat dissipation plate vertically arranged on the top surface of a heat conduction plate; a plurality of honeycomb-shaped through holes with two through ends are formed in the heat dissipation plate; a plurality of heat conduction holes are formed in the wall of the through hole in the longitudinal direction. The honeycomb-shaped hexagonal through hole structure is adopted, the contact area of the radiator and air in the unit area is increased, the speed of heat transfer from the center to the outside is increased, and the heat dissipation performance is improved; the heat conduction holes are combined with the heat conduction liquid which can expand after being heated, so that one part of the heat conduction liquid expands and dissipates heat along the heat conduction holes after being heated, and the other part of the heat conduction liquid is evaporated into a gas state after being heated and then condenses and dissipates heat after flowing along the heat conduction holes. The amount of heat conduction liquid is increased through the liquid storage cavity, and the heat dissipation efficiency is improved. The LED lamp is simple in structure, convenient to use, high in heat conduction efficiency, fast in heat dissipation, good in effect, high in practicability and wide in applicability.

Description

technical field [0001] The invention relates to a heat dissipation structure method, in particular to a heat dissipation structure and a heat dissipation method. Background technique [0002] As we all know, too high temperature will cause certain damage to most non-high temperature equipment, such as LED, solar battery or computer CPU, etc., because the temperature itself will rise during operation, if it is not dissipated in time and effectively, it will lighten to a certain extent The efficiency will drop, and the equipment will burn out. In this case, radiators are often used as auxiliary equipment to dissipate heat. Radiators are generally composed of heat dissipation structures and other auxiliary structures. In the prior art, heat sinks in heat dissipation structures are mostly rectangular. Moreover, the size of each heat sink is the same, and the space is not well utilized, resulting in a small heat dissipation area of ​​the heat sink and low heat dissipation efficie...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/2039H05K7/20309H05K7/20327H05K7/20318H05K7/20263H05K7/20272H05K7/20009
Inventor 郑强
Owner 福州长基生态农业科技发展有限公司